355 nm UV laser patterning and post-processing of FR4 PCB for fine pitch components integration

Dupont, F.; Stoukatch, Serguei; Laurent, Philippe; Dricot, Samuel; Kraft, Michaël

doi:10.1016/j.optlaseng.2017.08.014

Cited by 11 publications

(2 citation statements)

References 6 publications

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“…At the same time, the precipitation of Au usually occurs on the ceramic substrate along the copper line due to the effect of activation procedure. The overflow of gold-plated coating could cause electrical short-circuit [19,20].…”

Section: Introductionmentioning

confidence: 99%

Improved uniformity of Ni/Au coating on circuits by electroless plating

Liu

Tian

Lin

et al. 2019

Surface Engineering

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Cyanide-free electroless plating was used to deposit nickel/gold coating on the patterned circuits with fine-pitch. The relationship among the controlled process parameters, the skip plating, over-plating and pit forming were investigated. Results show that due to the uniform discharge sputtering, the copper layer is failed to be deposited around BVHs and lines of Al 2 O 3 samples. The skip plating is mainly caused by the self-oxide and the leakage sputtering with copper. Excess Pd activation may result in over-plating during plating nickel. With enhancing the uniformity of the substrate materials and raising the annealing temperature, the number of pits decreases significantly. The thickness of the Au coating can reach up to 2 µm with the smooth coating surface and without the spillover. The electroless plating Au progress can be used to fine-pitch selective area plating.

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Section: Introductionmentioning

confidence: 99%

Improved uniformity of Ni/Au coating on circuits by electroless plating

Liu

Tian

Lin

et al. 2019

Surface Engineering

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“…Various technologies have been utilized to fabricate dense conductive tracks on FPCBs or printed circuit boards (PCBs) among these technologies, pulsed laser ablation offers an excellent solution for precision micromachining of FPCBs and PCBs for small-scale production without the use of a mask 9 . B. Zhang 10 demonstrated that nanosecond pulsed excimer laser structuring of the copper layer on PCBs was implemented to obtain a smaller-sized circuit line/space by conveniently changing the spot size of the laser beam, and the effect of the laser parameters on the laser structuring quality was investigated.…”

Section: Introductionmentioning

confidence: 99%

Femtosecond Laser Machining of Flexible Printed Circuit Boards

Wang

Zhang

et al. 2022

J. Phys.: Conf. Ser.

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As the demand grows for high-density electronic components and highly integrated printed circuit boards, femtosecond laser micromachining provides unique opportunities for creating fine conductive tracks and patterns on flexible printed circuit boards (FPCBs) without the use of a mask. Here, the effects of femtosecond laser power and pulse frequency on micromachining depth, surface roughness and copper content of the machined zone were investigated, and optimum laser parameters, i.e., laser power 280 mW and pulse repetition frequency 39.5 kHz, were achieved with the help of a 3D optical profilometer and energy dispersive spectroscopy (EDS). On this basis, a single conductive track with varying widths and two parallel conductive tracks with different widths/spacings were micromachined on FPCBs without noticeable substrate damage. The results indicate that a single conductive line with a feature width as small as 25 µm can be achieved, and two parallel copper tracks can be created with no evidence of the presence of copper residues between the tracks when the pre-defined spacing is no less than 45 µm . In order to achieve high micromachining accuracy, look-up tables that correlate measured widths/spacing of conductive tracks with the pre-defined ones were built.besides, machining conductive tracks with 135 degree corner is possible and by selecting optimized processing parameters. Finally, a driving circuit for a display panel was micromachined on FPCBs using femtosecond laser, and an average micromachining accuracy of 0.67 μm was achieved. This work will be quite useful for creating high density and precision patterns on FPCBs using femtosecond laser.

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Modeling and process parameter optimization of laser cutting based on artificial neural network and intelligent optimization algorithm

Ren

Fan

Pan

et al. 2023

Int J Adv Manuf Technol

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355 nm UV laser patterning and post-processing of FR4 PCB for fine pitch components integration

Cited by 11 publications

References 6 publications

Improved uniformity of Ni/Au coating on circuits by electroless plating

Improved uniformity of Ni/Au coating on circuits by electroless plating

Femtosecond Laser Machining of Flexible Printed Circuit Boards

Modeling and process parameter optimization of laser cutting based on artificial neural network and intelligent optimization algorithm

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355 nm UV laser patterning and post-processing of FR4 PCB for fine pitch components integration

Cited by 11 publications

References 6 publications

Improved uniformity of Ni/Au coating on circuits by electroless plating

Improved uniformity of Ni/Au coating on circuits by electroless plating

Femtosecond Laser Machining of Flexible Printed Circuit Boards

Modeling and process parameter optimization of laser cutting based on artificial neural network and intelligent optimization algorithm

Contact Info

Product

Resources

About

355 nm UV laser patterning and post-processing of FR4 PCB for fine pitch components integration