3D analysis of crack morphologies in silicate glass using FIB tomography

Elfallagh, F.; Inkson, Beverley J.

doi:10.1016/j.jeurceramsoc.2008.05.042

Cited by 30 publications

(12 citation statements)

References 24 publications

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“…Therefore, difficulties of specimen preparation arising from conventional thinning by Ar + milling of glass and glass ceramic specimens have been overcome. The viscoelastic behavior expected in these materials give rise to a significant residual stress field which can drive material diffusion over time, leading to local stress relaxation and viscoelastic creep associated with surface cracks and also crystals of diverse size in the analyzed glass ceramics [6] [7]. TEM micrographs show droplets of liquid-liquid phase separation in BF images, dark contrast and bubbles produced by electron irradiation as well as stress fields produced in the residual glassy phase of these glass ceramics [8] [9].…”

Section: Methodsmentioning

confidence: 99%

Transmission Electron Microscopy (TEM) Through Focused ION Beam (FIB) from Vitrified Chromium Wastes

Ballesteros-Elizondo¹,

Parga-Torres

Rincón-López

et al. 2011

JART

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This study shows how the Focused Ion Beam (FIB) has been applied to vitrified materials obtained from chromiumwastes. Due to the issues arising during conventional Ar+ ion milling, it was necessary to thin these samples usingFIB. Difficulties came from the heterogeneous size between chromium spinels and the residual glass phase. The FIBwas applied to obtain thin foils from vitrified materials. These brittle and heterogeneous samples result in specimenswith many perforations and chipping when using conventional thinning below 100 nanometers. Alternatively, FIBallowed thinning in the range of 60 - 80 nanometers from specifically selected areas such as the areas containingspinel crystals Mg(Al,Cr)2O4 in order to facilitate the final Transmission Electron Microscopy (TEM) observations. Inthis paper, FIB is shown to be a very powerful microtool as a brittle samples preparation method as well as providingan alternative way for performing conventional ceramography and Ar+ ion milling. FIB is a much less destructivemethod with greater observed capacity in the quantity and analysis of microcrystalline phases.

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Section: Methodsmentioning

confidence: 99%

Transmission Electron Microscopy (TEM) Through Focused ION Beam (FIB) from Vitrified Chromium Wastes

Ballesteros-Elizondo¹,

Parga-Torres

Rincón-López

et al. 2011

JART

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“…Electron Microscopy (FIB/SEM) technology became a versatile materials morphology characterization technique [1][2][3][4][5]. It provides higher voxel resolution compared to X-ray tomographytens of nanometers or, in some cases, even several nanometers.…”

Section: D Visualization Enabled By Dual Beam Microscopes Combining mentioning

confidence: 99%

FIB/SEM Tomography of Porous Ceramics

Rezikyan

2016

Microsc Microanal

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“…Focused ion beam scanning electron microscopy (FIB-SEM) allows nanoscale milling with the FIB to reveal subsurface features of materials for imaging with the SEM column. 27,28 This technique has been used to investigate subsurface indentation fracture in alumina, 29 silicate glass, 30 SiAlON, 31 and silicon nitride. 32 Local residual stresses were observed to cause bulging of FIB cross-sections, and the direction of FIB milling through the indent changed the observed crack density as residual stresses were relieved.…”

Section: Introductionmentioning

confidence: 99%

“…32 Local residual stresses were observed to cause bulging of FIB cross-sections, and the direction of FIB milling through the indent changed the observed crack density as residual stresses were relieved. 29 , 30 This work aims to explore the relationships between fracture, plastic deformation, and residual stresses around nanoindentations in unirradiated and irradiated silicon carbide, and how this affects mechanical properties measured by nanoindentation. FIB cross-sectioning is applied to investigate subsurface fracture.…”

Section: Introductionmentioning

confidence: 99%

Effect of Ion Irradiation on Nanoindentation Fracture and Deformation in Silicon Carbide

Leide

Todd

Armstrong

2021

JOM

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Silicon carbide is desirable for many nuclear applications, making it necessary to understand how it deforms after irradiation. Ion implantation combined with nanoindentation is commonly used to measure radiation-induced changes to mechanical properties; hardness and modulus can be calculated from load–displacement curves, and fracture toughness can be estimated from surface crack lengths. Further insight into indentation deformation and fracture is required to understand the observed changes to mechanical properties caused by irradiation. This paper investigates indentation deformation using high-resolution electron backscatter diffraction (HR-EBSD) and Raman spectroscopy. Significant differences exist after irradiation: fracture is suppressed by swelling-induced compressive residual stresses, and the plastically deformed region extends further from the indentation. During focused ion beam cross-sectioning, indentation cracks grow, and residual stresses are modified. The results clarify the mechanisms responsible for the modification of apparent hardness and apparent indentation toughness values caused by the compressive residual stresses in ion-implanted specimens.

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3D analysis of crack morphologies in silicate glass using FIB tomography

Cited by 30 publications

References 24 publications

Transmission Electron Microscopy (TEM) Through Focused ION Beam (FIB) from Vitrified Chromium Wastes

Transmission Electron Microscopy (TEM) Through Focused ION Beam (FIB) from Vitrified Chromium Wastes

FIB/SEM Tomography of Porous Ceramics

Effect of Ion Irradiation on Nanoindentation Fracture and Deformation in Silicon Carbide

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