3D characterisation of tool wear whilst diamond turning silicon

Durazo-Cardenas, Isidro Sergio; Shore, Paul; Luo, Xichun; Jacklin, T.; Impey, S. A.; Cox, Andrew

doi:10.1016/j.wear.2006.05.022

Cited by 70 publications

(29 citation statements)

References 17 publications

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“…The selection of cutting parameters and coolant was based on previous established research work of diamond turning of silicon to attain high optical quality machining [27]. Large nose radius tools were used as they provide strong edge geometry to withstand higher frictional resistance and higher cutting forces.…”

Section: Experimental Planmentioning

confidence: 99%

Investigation of influence of tool rake angle in single point diamond turning of silicon

Mir

Luo

Cheng

et al. 2017

Int J Adv Manuf Technol

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This paper presents an investigation of the effect of tool rake angle in single point diamond turning (SPDT) of silicon using experimental and simulation methods. Machining trials under the same cutting conditions were carried out using three different rake angle tools. In order to delve further into the rake angle effect on the output parameters including material removal, stresses and crack formation, at the onset of chip formation and steady-state conditions, a simulation study using smoothed particle hydrodynamics (SPH) approach was performed. The simulation results were incorporated and found in good agreement with experimental observations. The results indicate that diamond tool wear rate and surface generation mechanism significantly vary using different rake angle tools. The continuance of compressive and shear deformation sequence at the chip incipient stage governs the high-pressure phase transformation (HPPT) as a function of rake angle and tool wear. The capability of diamond tool to maintain this sequence and required hydrostatic pressure under worn conditions is highly influenced by a change in rake angle. The proportional relationship of cutting force magnitude and tool wear also differs owing to disparate wear pattern which influence distribution of stresses and uniform hydrostatic pressure under the tool cutting edge. This subsequently influences structural phase transformation and therefore frictional resistance to cutting. Mainly frictional groove wear was found dominant for all diamond tools in machining of silicon.

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Section: Experimental Planmentioning

confidence: 99%

Investigation of influence of tool rake angle in single point diamond turning of silicon

Mir

Luo

Cheng

et al. 2017

Int J Adv Manuf Technol

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show abstract

“…Данной проблеме посвящено большое количество научных исследований, и во всех работах упоминается хрупкопластич-ный переход. Это явление, наблюдающееся при обработке кремния и других хрупких материа-лов, проявляется в том, что при определенных условиях их можно обрабатывать как пластич-ные [4][5][6][7][8][9].…”

Section: физикоunclassified

“…До этого момента резание выполня-лось в пластичном режиме. В работе [6], посвященной обработке крем-ния лезвийным алмазным инструментом, опи-саны стойкостные эксперименты с использова-нием различных смазочно-охлаждающих жид-костей (СОЖ) и при разных геометрических параметрах инструмента, а также при неодина-ковых кристаллографических ориентациях ал-маза, закрепленного в резце. В исследовании по определению влияния СОЖ на стойкость ин-струмента применялся алмазный резец с радиу-сом при вершине r = 0,5 мм и углами  = -25,  = 10.…”

Section: физикоunclassified

Experimental Studies of Ultra-Precision Cutting Edge Machining of Silicon

Лапшин¹,

Grubyi²

2017

PoHEI.MB

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В современной оптической промышленности широкое распространение находят оп-тические детали, изготовленные из монокристаллического кремния. К ним предъяв-ляются высокие требования по точности и качеству обработки. Кремний относится к труднообрабатываемым хрупким материалам, однако при определенных условиях его можно обработать в режиме пластичного резания. В качестве режущего инструмента используют резцы с режущей частью из монокристаллического алмаза. Проведены литературный обзор по способам достижения режимов пластичной обработки крем-ния, а также анализ данных по износостойкости алмазных резцов. По результатам аналитического обзора поставлена задача экспериментального определения режимов лезвийной обработки монокристаллического кремния, а также исследования износа и стойкости алмазных резцов. Проведенные эксперименты показали возможность пла-стичной обработки кремния. Получены данные о стойкости алмазных лезвийных ин-струментов с заданной геометрией режущей части при различных условиях обработ-ки.Ключевые слова: сверхточная лезвийная обработка, алмазное точение, алмазный мо-нокристаллический резец, монокристаллический кремний.Parts made from monocrystalline silicon are widely used in modern optical industry. These must meet high standards of precision and machining quality. Silicon belongs to the category of hard-to-machine brittle materials; however, under certain conditions, the material can be processed in ductile cutting mode. Cutters with monocrystalline cutting heads are used for machining. A literature review of ductile cutting methods and a data analysis of wear resistance of diamond cutters were performed. Based on the analytical review, a problem was formulated on the experimental determination of monocrystalline silicon cutting modes and the study of wear and durability of diamond cutters. The conducted experiments have shown the possibility of ductile machining of silicon. The data -------* Работа выполнена в рамках Соглашения от 25.08.2014 № 14.579.21.0042 (уникальный идентификатор RFMEFI57914X0042) между ОАО «ВНИИИНСТРУМЕНТ» и Министерством образования и науки РФ по теме «Разра-ботка технологии и оборудования наноразмерной обработки алмазным монокристаллическим и абразивным инстру-ментом оптических материалов в режиме квазипластичного резания».

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“…They concluded that ductile machining can be achieved by using a diamond tool with a negative effective rake angle. With regard to the cutting tool performance, Durazo-Cardenas et al [14] characterised the wear mechanisms of the diamond tool, and found that micromachining and chipping were the most frequent wear modes. Born and Goodman [15] also studied the effect of varying the machining conditions, such as depth of cut, feed rate, and cutting speed in combination with changing tool geometry on the diamond tool wear modes.…”

Section: Diamond Machining Of Optical Silicon Surfacesmentioning

confidence: 99%

Quality of silicon convex lenses fabricated by ultra-high precision diamond machining

Abou-El-Hossein¹

2013

sajie

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Infra-red optical components are made mainly from hard and brittle materials such as germanium and silicon. Silicon machining is characterised by some difficulties when ultrahigh precision machined by mono-crystalline single-point diamond. Accelerated tool wear and machined-surface deterioration may take place if the machining parameters are not properly selected. In this study, we conducted a machining test on an ultra-high precision machine tool, using ductile regime cutting conditions when fabricating a convex surface on a silicon lens of aperture of 60 mm diameter, and using a mono-crystalline diamond. It was found that the cutting conditions for shaping a convex surface of 500 mm radius resulted in good form accuracy. However, more attention should be paid to optimising the holding force of the vacuum chuck employed. OPSOMMINGInfrarooi optiese komponente word hoofsaaklik van harde, bros materiale soos germanium en silikon gemaak. Ultra-hoë akkurate masjinering van silikon met 'n mono-kristallyne enkelpunt diamantbeitel gee aanleiding tot verskeie probleme. Versnelde beitelslytasie en degradering van die masjineringsoppervlak kan plaasvind indien die masjineringsparameters nie behoorlik gekies word nie. In hierdie studie het ons 'n masjineringstoets uitgevoer met 'n ultra-hoë akkurate masjineringstelsel, waar rudraaiwerk gebruik is om die konvekse oppervlak van 'n silikonlens met 'n 60 mm opening met 'n mono-kristallyne enkelpunt diamantbeitel te masjineer. Daar is bevind dat die snytoestande wat gebruik is om die konvekse oppervlak met 500 mm radius te vorm, tot goeie vorm-akkuraatheid gelei het. Meer aandag moet egter gegee word aan die optimering van die vashoukrag van die vakuum-kloukop wat gebruik word. a a a a a a a a a a a a a a a a a

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3D characterisation of tool wear whilst diamond turning silicon

Cited by 70 publications

References 17 publications

Investigation of influence of tool rake angle in single point diamond turning of silicon

Investigation of influence of tool rake angle in single point diamond turning of silicon

Experimental Studies of Ultra-Precision Cutting Edge Machining of Silicon

Quality of silicon convex lenses fabricated by ultra-high precision diamond machining

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