3D fabrication by moving mask deep X-ray lithography (M/sup 2/DXL) with multiple stages

Tabata, Osamu; Matsuzuka, Naoki; Yamaji, Tomohito; Uemura, Sadao; Yamamoto, Kazuo

doi:10.1109/memsys.2002.984234

Cited by 22 publications

(15 citation statements)

References 5 publications

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“…Various kinds of microfabrication processes were developed and studied by the researchers over the decades including surface micromachining [2], bulk micromachining [3], and LIGA process [4] until recently, when three-dimensional (3D) microstructures like microlenses, micro/nanotips, microtrapezoids have been focused in various microsystems such as microfluidics, micro optics, electronic and mechanical devices [5][6][7][8] for which these processes have been considered inadequate. New processes were introduced in order to fabricate such complex 3D microstructures including deep reactive ion etching [9], inclined UV lithography [10], thermal reflow [11,12], focused ion beam [13,14], UV proximity printing [15,16], UV microstamping [17] and so on [18,19].…”

Section: Introductionmentioning

confidence: 99%

Dimensionally controlled complex 3D sub-micron pattern fabrication by single step dual diffuser lithography (DDL)

Hafeez

Ryu

et al. 2015

Microelectronic Engineering

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Section: Introductionmentioning

confidence: 99%

Dimensionally controlled complex 3D sub-micron pattern fabrication by single step dual diffuser lithography (DDL)

Hafeez

Ryu

et al. 2015

Microelectronic Engineering

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“…In this method, the exposing energy of X-rays on photoresist is controlled by rotating and scanning an X-ray mask. Fabrication of inclined side wall structures by controlling the exposure energy is now regarded as a standard procedure for doing this job (Tabata et al 2002;Horade et al 2007). Moreover, for such an X-ray mask that is essentially a MEM device, there is a mechanism in place to move X-ray absorbers by a micro actuator (Lee and Lee 2005).…”

Section: Introductionmentioning

confidence: 99%

Inclination of mold pattern’s sidewalls by combined technique with photolithography at defocus-positions and electroforming

et al. 2009

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We succeeded in achieving inclined sidewalls in a positive-tone photoresist structure by adjusting the focus offsets in a projection ultraviolet (UV) lithography system. In our experiments, highly precise patterns on Ni-electroformed mold were replicated from a photoresist master. The practicality of the mold was then evaluated by thermal nanoimprint experiments on polycarbonate (PC). When the focus offsets became small by moving the UV image plane (defined by wafer surface) closer to the lens the inclined angles of the photoresist walls increased. In this work, the release force was measured using a desktop nanoimprint system equipped with a load cell that measured not only the compression power but also the tensile force in the de-molding process. Starting from the glass transition temperature T g (144°C) of PC, the heating temperature in the molding process was changed by increments of 10°C resulting in T g ? 10, T g ? 20, and T g ? 30°C. The result showed that the release force decreased with increasing incline angles. It was observed that the more inclined the sidewalls of the mold pattern were, further small the release forces became, and the mold pattern became to be defended from deformation.

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“…The fabrication of 3D microstructures has been conventionally achieved by different methods including layer-by-layer process, LIGA process and other x-ray lithography techniques, surface and bulk micromachining, micro-stereo lithography, and inclined or rotated UV lithography [1][2][3][4][5][6][7][8]. While these methods have their own advantages, they also have some drawbacks.…”

Section: Introductionmentioning

confidence: 99%

Arbitrary three-dimensional micro-fabrication by polymer grayscale lithography

Nath

Korivi

2009

SPIE Proceedings

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We report on the continuing development of a grayscale lithography technique based on the use of a polymeric grayscale photomask. Arbitrary three-dimensional (3D) microstructures can be realized in positive and negative photoresist materials by the use of the polymeric grayscale photomask with standard ultra-violet (UV) lithography. The fabrication of such 3D structures depends on the differential absorption of in photo-absorbing material. The photomask is made of patterned polydimethylsiloxane (PDMS) polymer doped with a UV absorbing laser dye. The PDMS photomask contains micro-patterns made by micro-molding the PDMS on a complementary silicon master mold. By adjusting the thickness of the patterns on the polymer photomask, the dopant dye concentration in the photomask and UV exposure dose, a multitude of unique 3D microstructures can be fabricated on the substrate with desired geometries and dimensions. While the feasibility of grayscale lithography with such a polymeric mask has been reported by us earlier, this paper describes the fabrication of master mold and polymeric grayscale photomask.

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3D fabrication by moving mask deep X-ray lithography (M/sup 2/DXL) with multiple stages

Cited by 22 publications

References 5 publications

Dimensionally controlled complex 3D sub-micron pattern fabrication by single step dual diffuser lithography (DDL)

Dimensionally controlled complex 3D sub-micron pattern fabrication by single step dual diffuser lithography (DDL)

Inclination of mold pattern’s sidewalls by combined technique with photolithography at defocus-positions and electroforming

Arbitrary three-dimensional micro-fabrication by polymer grayscale lithography

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