2020 IEEE 70th Electronic Components and Technology Conference (ECTC) 2020
DOI: 10.1109/ectc32862.2020.00163
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3D Heterogeneous and Flexible Package Integration for Zero-Power Wireless Neural Recording

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Cited by 3 publications
(1 citation statement)
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“…Higher standoff height decreases the von Mises stress of the silver adhesive interconnects. Based on initial analysis, von Mises stresses reduced by about 50% when taller interconnect height of 30 μm was used instead of 10 μm to [22]. A higher interconnection height offers lower von Mises stresses that act on the silver adhesives to offer better bending flexibility.…”
Section: Embedded-chip Package Structure and Mechanical Modelingmentioning
confidence: 99%
“…Higher standoff height decreases the von Mises stress of the silver adhesive interconnects. Based on initial analysis, von Mises stresses reduced by about 50% when taller interconnect height of 30 μm was used instead of 10 μm to [22]. A higher interconnection height offers lower von Mises stresses that act on the silver adhesives to offer better bending flexibility.…”
Section: Embedded-chip Package Structure and Mechanical Modelingmentioning
confidence: 99%