3D-IC FPGA: KGD, DFT and build-in FA capabilities

Abstract

Among many challenges in the development of 3D-IC products, cost is one of the top concerns. Within cost elements, known-good-die (KGD) and 3D-IC integration yield, are among a few biggest impacting factors. In order to achieve high 3D-IC integration yield, build-in self-repairing, design-for-testing (DFT), diagnostic, and failure analysis (FA) capabilities, are very important elements of 3D-IC FPGA technology and product development and manufacturing.