3D momentum modeling technique and measurements of CPW compact GaAs multilayer MMICs

Design and analysis of compact MMIC switches utilising GaAs pHEMTs in 3D multilayer technology

“…The accuracy in design and simulation of SPST and SPDT pHEMT switches is ensured by comparing the simulated and measured data with the extracted data obtained from the small-signal model. Our investigations in several multilayer devices utilising pHEMT have shown that the differences between the simulated and measured results are due to the use of standard TOM3 model in ADS simulation tool, which does not consider the effect of multilayer processing as discussed in Section 2 [17]. Besides that, the measurements do not reflect the actual results since the effects of the internal VNA features and the test fixtures are not considered due to calibration reference plane used.…”

3D Modeling Parallel Coupled-Line Bandpass Filter Based on Coplanar Waveguide MMIC Multilayer Technology

“…There are several simulation steps in designing MMIC using simulators such as Agilent ADS Momentum© which are suitable for designing layout components i.e. defining substrate, settingup ports, defining frequency and output plans as well as defining mesh simulation [6]. The followings are important parameters that need to be taken into account for accurate layout simulation.…”

“…Gold is a type of conductor with a very good conductivity. Component characteristic losses resulting from default simulation settings do not represent accurate losses that occur in the fabricated component in onwafer measurements [6]. This is caused by the laying operation of the conductor layer in the default simulation parameters.…”

“…This is caused by the laying operation of the conductor layer in the default simulation parameters. In default simulation settings, the loss of conductor has not been considered [6]. The solution is to expand the conductor layer using the 3D expansion feature by selecting operation conductor as intrude into substrate with the above interface position between the metal conductor and the substrate.…”

“…There are several important features that can increase the accuracy of layout modeling such as "reference offset, mode of operation, and mesh formats. In the work published in [6], it is shown the effectiveness of utilizing these features in designing passive and active components. Therefore in this paper, it is demonstrated further the use of accurate 3D modeling technique in optimizing the design and simulation of Parallel Coupled-Line Bandpass Filter that has operating frequency of 2 GHz.…”