3D Printable, form stable, flexible phase-change-based electronic packaging materials for thermal management

Feng, Chang‐Ping; Sun, Kai-Yin; Ji, Jin-Chao; Hou, Lei; Cui, Gong-Peng; Zhao, Zhongguo; Lan, Hongbo

doi:10.1016/j.addma.2023.103586

Cited by 10 publications

(5 citation statements)

References 64 publications

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“…The printer enabled the 3D printing process by means of a compressor unit, a pressure controller, and a 3-axis table, acting together. 40 The print head was connected with a needle of 0.31 mm (24 G, Table S1), the pressure was controlled at 50 kPa, and the ink was printed at 5 mm s −1 . During the printing process, the substrate needed to be heated to 333 K, which should not be too high to prevent the PI film from warping during the printing process.…”

Section: Methodsmentioning

confidence: 99%

“…The ink was filled into a 5 mL plastic syringe and then pneumatically extruded through a nozzle. The printer enabled the 3D printing process by means of a compressor unit, a pressure controller, and a 3-axis table, acting together . The print head was connected with a needle of 0.31 mm (24 G, Table S1), the pressure was controlled at 50 kPa, and the ink was printed at 5 mm s –1 .…”

Section: Methodsmentioning

confidence: 99%

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3D-printed Bi₂Te₃-based Thermoelectric Generators for Energy Harvesting and Temperature Response

Cui,

Feng,

et al. 2024

ACS Appl. Mater. Interfaces

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Section: Methodsmentioning

confidence: 99%

Section: Methodsmentioning

confidence: 99%

3D-printed Bi₂Te₃-based Thermoelectric Generators for Energy Harvesting and Temperature Response

Cui,

Feng,

et al. 2024

ACS Appl. Mater. Interfaces

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“…Feng et al successfully enclosed paraffin within a strong, interconnected 3D polymer network to develop packaged phase‐change electronics into microdevices with complex circuitry using fused jet deposition 3D printing, ensuring significant preservation of its shape integrity 20 . Their innovative 3D printable phase‐change electronic packaging materials outperform conventional options, achieving a remarkable 13°C cooling effect.…”

Section: Application Of Polymer‐based Sspcmmentioning

confidence: 99%

“…However, some polymer‐based SSPCMs encounter several challenges such as leakage, thermal decay, and reduced thermal conductivity 18 . These issues came into effect from factors like poor bonding between polymer blends and protective layers, concerns regarding stabilization, and so on 19,20 . This may slow down the flow of heat between the PCM and its surroundings when it undergoes thermal cycling, which in turn can decrease the efficiency with which energy is stored and released 21 .…”

Section: Introductionmentioning

confidence: 99%

A critical review of polymer support‐based shape‐stabilized phase change materials for thermal energy storage applications

Bidiyasar,

Kumar,

Jakhar

2024

Energy Storage

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Phase change materials (PCMs) have drawn considerable attention in recent years due to their capability of storing and releasing thermal energy during phase transformation. However, traditional PCMs face challenges like limited thermal conductivity, leakage while phase transformation from solid to liquid, thermal degradation, and durability. Researchers have concentrated on creating shape‐stabilized PCMs (SSPCMs) employing polymers as the supporting matrix to overcome these difficulties and incorporating highly thermally conductive additives to improve thermal conductivity. Compared to conventional PCMs, polymer‐based SSPCMs are often more flexible, lightweight, and durable and may be easily customized according to specific applications. Various factors like PCM loading, thermal cyclability, cost‐effectiveness and environmental concerns must be considered while constructing polymer‐based SSPCMs. This review paper comprehensively explored various polymers, including polyurethane, polyacrylates, polyolefin, and so on, as promising supporting materials for SSPCMs due to their relatively high mechanical strength, compatibility with PCM, excellent thermal stability, and chemical resistance. Natural polymers like chitosan, cellulose, and starch are also considered for eco‐friendly solutions. We have also discussed about specific properties of each polymer, their cost‐effectiveness, and the environmental impact while developing such SSPCMs to guide researchers in material selection. Applications of polymer‐based SSPCMs in solar energy storage, medical devices, building materials, electronics, transportation industry, and waste heat recovery are briefly discussed. Finally, some future development areas have been discussed to attract the attention of new researchers in this field. The information provided in this review will assist readers in understanding polymer‐based SSPCM and selecting their desired polymer for support material with diverse application methods.

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“…This means that Ag and Au can be completely mixed in the solid phase without any IMCs. This is involved to high latent heat phase change-based electronic packaging materials [7]. Meanwhile, the price of Ag is one hundredth that of Au [8].…”

Section: Introductionmentioning

confidence: 99%

Phase Equilibria of the Ag-Al-Au Ternary System and Interfacial Reactions in the Au-xAg/Al Couples at 450 °C

Ramadhani,

Laksono,

Liang

et al. 2023

Materials

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The phase equilibria of the Ag-Al-Au ternary system and the solid-state reaction couple for the Au-xAg/Al system were investigated isothermally at 450 °C. By investigating the Ag-Al-Au ternary system and its isothermal section, this study aims to provide a clearer understanding of the phase stability and interfacial reactions between different phases. This information is crucial for designing materials and processes in electronic packaging, with the potential to reduce costs and improve reliability. There were seven single-phase regions, thirteen two-phase regions, and six three-phase regions, with no ternary intermetallic compound (IMC) formed in the isothermal section of the Ag-Al-Au ternary system. When the Au-25 wt.% Ag/Al couple was aged at 450 °C for 240–1500 h, the AuAl2, Au2Al, and Au4Al phases formed at the interface. When the Ag contents increased to 50 and 75 wt.%, the Ag2Al, AuAl2, and Au4Al phases formed at the interface. When the aging time increased from 240 h to 1500 h, the total IMC thickness in all Au-xAg/Al couples became thicker, but the types of IMCs formed at the interface did not change. The total IMC thickness also increased with the increase in the Ag content. When the Ag content was greater than 25 wt.%, the Au2Al phase was converted into the Ag2Al phase. The IMC growth mechanism in all of the couples followed a reaction-controlled process.

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3D Printable, form stable, flexible phase-change-based electronic packaging materials for thermal management

Cited by 10 publications

References 64 publications

3D-printed Bi₂Te₃-based Thermoelectric Generators for Energy Harvesting and Temperature Response

3D-printed Bi₂Te₃-based Thermoelectric Generators for Energy Harvesting and Temperature Response

A critical review of polymer support‐based shape‐stabilized phase change materials for thermal energy storage applications

Phase Equilibria of the Ag-Al-Au Ternary System and Interfacial Reactions in the Au-xAg/Al Couples at 450 °C

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3D Printable, form stable, flexible phase-change-based electronic packaging materials for thermal management

Cited by 10 publications

References 64 publications

3D-printed Bi2Te3-based Thermoelectric Generators for Energy Harvesting and Temperature Response

3D-printed Bi2Te3-based Thermoelectric Generators for Energy Harvesting and Temperature Response

A critical review of polymer support‐based shape‐stabilized phase change materials for thermal energy storage applications

Phase Equilibria of the Ag-Al-Au Ternary System and Interfacial Reactions in the Au-xAg/Al Couples at 450 °C

Contact Info

Product

Resources

About

3D-printed Bi₂Te₃-based Thermoelectric Generators for Energy Harvesting and Temperature Response

3D-printed Bi₂Te₃-based Thermoelectric Generators for Energy Harvesting and Temperature Response