3D printed electronics: Processes, materials and future trends

Recent Advances in Multi-Material 3D Printing of Functional Ceramic Devices

“…In DOD inkjet printing, ink droplets are ejected from thousands of orifices, typically arranged in each printhead as an array by inducing a transient pressure pulse within the chamber only when printing is needed [ 60 ]. A DOD inkjet printer can adopt several printheads with different driving mechanisms: piezoelectric (PTZ), thermal, acoustic, and electrostatic ( Figure 4 a,b,d,e) [ 61 , 62 ], among which piezoelectric and thermal printheads are most widely used. Alternatively, a thermal printhead relies on a resistor to heat the ink within the ink chamber until a bubble expands in it, forcing a droplet out of the orifice [ 63 ].…”

Electrically reading a light-driven molecular switch on 2D-Ti3C2Tx MXene via molecular engineering: towards responsive MXetronics

“…39,40 In this regard, 3D printing has proven to be a powerful technology for the large-scale manufacture of free-form electronic devices on-demand. 41,42 Interestingly, two electrical states (0, 1) at the MXetronic/electrolyte interface were successfully discerned by CV. Accordingly, the significant findings of this proof-of-concept paves the way towards the yet undisclosed concept of “Responsive MXetronics” by devising programmable MXenes carrying active molecules, which supposes the principle to reach complex logic functions at the molecular level.…”

Rational Design and Characterization of Materials for Optimized Additive Manufacturing by Digital Light Processing

“…Many companies have commercialized ceramic and metal-based DLP printers and resins for producing high-end parts [ 7 ]. Currently, the technology is being used to produce 3D parts using functional materials [ 17 ], such as elastomers [ 18 ], conductive polymers [ 19 , 20 ], shape memory polymers [ 21 ], biopolymers [ 22 , 23 , 24 , 25 ], and piezoelectric materials [ 26 ]. These photocurable, environmentally responsive materials add another dimension to the printed part, extending 3D printing to 4D printing [ 27 , 28 , 29 ].…”