2019 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS) 2019
DOI: 10.1109/fleps.2019.8792234
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3D Printed Interconnects on Bendable Substrates for 3D Circuits

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Cited by 12 publications
(2 citation statements)
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“…1a and 1b). The housing of the channel and the capacitive sensors are all printed as one structure using multimaterial 3D printing techniques [38,39]. The sensor utilizes the principle of capacitive fluid level sensing to determine the orientation of any object it is attached to.…”
Section: Introductionmentioning
confidence: 99%
“…1a and 1b). The housing of the channel and the capacitive sensors are all printed as one structure using multimaterial 3D printing techniques [38,39]. The sensor utilizes the principle of capacitive fluid level sensing to determine the orientation of any object it is attached to.…”
Section: Introductionmentioning
confidence: 99%
“…The latest advancements in materials and custom systems for 3D printers, have enhanced their capabilities even further. Some of the advantages can be found in 3D printed interconnects, embedded sensors, 3D printed antennas or 3D printed scaffolds, to name a few [28][29][30][31][32]. Lately, 3D printed technologies have been used in industries, such as automation, aeronautic, bioengineering or robotics as a prototyping method as well as to fabricate the final parts [33][34][35].…”
Section: Introductionmentioning
confidence: 99%