2015
DOI: 10.1038/micronano.2015.13
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3D-printed microelectronics for integrated circuitry and passive wireless sensors

Abstract: Three-dimensional (3D) additive manufacturing techniques have been utilized to make 3D electrical components, such as resistors, capacitors, and inductors, as well as circuits and passive wireless sensors. Using the fused deposition modeling technology and a multiple-nozzle system with a printing resolution of 30 μm, 3D structures with both supporting and sacrificial structures are constructed. After removing the sacrificial materials, suspensions with silver particles are injected subsequently solidified to f… Show more

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Cited by 233 publications
(184 citation statements)
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“…suspensions in which the carrier remains liquid after infusion (Ota et al, 2016); 2. suspensions in which the carrier solidifies after infusion (Czyzewski et al, 2009;Vatani et al, 2015), e.g. by light curing (Vatani et al, 2015), resin developing (Muth et al, 2014) or evaporation of solvents (Pella); and 3. suspensions in which the carrier evaporates after infusion (Ko et al, 2010;Wu et al, 2015;Harada et al, 2014).…”
Section: Infused Conductorsmentioning
confidence: 99%
See 1 more Smart Citation
“…suspensions in which the carrier remains liquid after infusion (Ota et al, 2016); 2. suspensions in which the carrier solidifies after infusion (Czyzewski et al, 2009;Vatani et al, 2015), e.g. by light curing (Vatani et al, 2015), resin developing (Muth et al, 2014) or evaporation of solvents (Pella); and 3. suspensions in which the carrier evaporates after infusion (Ko et al, 2010;Wu et al, 2015;Harada et al, 2014).…”
Section: Infused Conductorsmentioning
confidence: 99%
“…regular wiring, printed circuit boards or entire sensors; 2. conductor infusion, i.e. printing channels in otherwise non-conductive materials by arbitrary AM methods with subsequent infusion of conductive inks (Wu et al, 2015); and 3. multi-material printing, i.e. combining the use of conductive and non-conductive filaments (Leigh et al, 2012), predominantly by fused deposition modelling (FDM).…”
Section: Current Technology For Embedded Sensorsmentioning
confidence: 99%
“…Additive manufacturing and three-dimensional (3D) printing have improved access to and flexibility of highquality fabrication technology with profound impact on a number of industries 1 , including automotive, electronics [2][3][4] , aerospace, bio-engineering 5,6 , and microfluidics 7 . Complex to fabricate optical devices [8][9][10] and systems can similarly benefit from the ability of 3D printing to create low-cost structures of nearly arbitrary shape 11,12 .…”
Section: Introductionmentioning
confidence: 99%
“…The applications for such conductive filaments can be numerous [12]. They can be used to build sensors, integrated circuitry and for the production of low cost wearable materials that can pass on signals and data for health control.…”
Section: D Disseminationmentioning
confidence: 99%