2022
DOI: 10.1039/d2lc00612j
|View full text |Cite
|
Sign up to set email alerts
|

3D printing-enabled uniform temperature distributions in microfluidic devices

Abstract: Many microfluidic processes rely heavily on precise temperature control. Though internally-contained heaters have been developed using traditional fabrication methods, they are limited in their ability to isothermally heat a precisely...

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1
1

Citation Types

0
4
0

Year Published

2023
2023
2023
2023

Publication Types

Select...
5
1

Relationship

1
5

Authors

Journals

citations
Cited by 7 publications
(4 citation statements)
references
References 45 publications
0
4
0
Order By: Relevance
“…Methods such as photolithography are also expensive in terms of manufacture and maintenance of the working environment and apparatus. Thanks to recent advances in fabrication technology, an increasing number of researchers are making use of high-precision 3D printing or CNC milling to design and test prototypes ( Trinh et al, 2018 ; Sanchez et al, 2022 ). Once the channel design is defined, mass production via injection molding (which allows for a finest possible structure of 10–100 μm) would reduce the price of manufacturing chips or cartridges.…”
Section: All-in-one Systems and Future Perspectivesmentioning
confidence: 99%
“…Methods such as photolithography are also expensive in terms of manufacture and maintenance of the working environment and apparatus. Thanks to recent advances in fabrication technology, an increasing number of researchers are making use of high-precision 3D printing or CNC milling to design and test prototypes ( Trinh et al, 2018 ; Sanchez et al, 2022 ). Once the channel design is defined, mass production via injection molding (which allows for a finest possible structure of 10–100 μm) would reduce the price of manufacturing chips or cartridges.…”
Section: All-in-one Systems and Future Perspectivesmentioning
confidence: 99%
“…We modified our existing COMSOL model that had been verified previously to represent the current setup of the system [37]. The thermal properties of the chip were from modifications to COMSOL's material library entry for nylon [37], as our previous independent investigation for the thermal conductivity of PEGDA determined the properties are comparable. As the thermal properties of galinstan are not reported in the literature, it was modeled as liquid gallium, its main constituent.…”
Section: Comsol Modelingmentioning
confidence: 99%
“…To overcome this limitation, we followed the process in Ref [36] where the knowledge of temperature at a single point is combined with precise thermal modeling to represent the spatial distribution around that point. Using previous validated COMSOL multiphysics models [37], we modeled the thermal environment of the experimental setup shown in Figures 4a and 5 and determined the temperature distribution within the 3D printed device (Figure 4b). The model was adjusted until the predicted temperature matched the measured temperature of the thermocouple that was located within the device (green dot in Figure 6).…”
Section: Experimental System Data and Associated Imagesmentioning
confidence: 99%
See 1 more Smart Citation