3D Printing of a PDMS Cylindrical Microlens Array with 100% Fill-Factor

Zhang, Houchao; Qi, Tianyu; Zhu, Xiaoyang; Zhou, Longjian; Li, Zhenghao; Yang, Wenchao; Yang, Jianjun; Peng, Zilong; Zhang, Guangming; Wang, Fei; Guo, Pengfei; Lan, Hongbo

doi:10.1021/acsami.1c08652

Cited by 35 publications

(25 citation statements)

References 52 publications

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“…Accurate control of the line width and cross‐sectional area of the printed wire is the key to achieving the integrity of the electronic system. [ 42,43 ] In addition, the surface morphology of the wire not only determines the resistance of the printed wire but also has an impact on the improvement of the performance of the device. [ 44,45 ] Therefore, we systematically study the influence of process parameters on the printing results to obtain the wire with good shape and stable conductivity.…”

Section: Resultsmentioning

confidence: 99%

Directly Printed Interconnection Wires between Layers for 3D Integrated Stretchable Electronics

Sun

Zhang

Zhu

et al. 2022

Adv Materials Technologies

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Multilayer circuits, especially in stretchable electronic devices, are considered to be an effective way to integrate various components and modules for complex functions. However, the existing manufacturing methods for multilayer flexible and stretchable electronics have problems such as complex technology, expensive equipment, and low production efficiency. Here, a direct ink writing 3D printing method is proposed to fabricate multilayer stretchable electronic devices by using high‐viscosity stretchable silver paste as the material for interconnecting wires, and stretchable polydimethylsiloxane as the dielectric layer. The optimal range of printing parameters is explored to realize the stable and repeatable manufacturing of wires. A protective layer is printed on the interconnection wires and rigid components to connect the soft substrate and the rigid electronic components. The results show that stress concentration is reduced and stable electrical response of the device is achieved under more than 49% tensile deformation. Vertical interconnect accesses and arc‐shaped wires are applied to a multilayer flexible thermal imaging display device and a NE555 timer device, and the outcomes prove that the direct ink writing 3D printing method provides an efficient, simple, and low‐cost manufacturing method for fabricating multilayer stretchable electronics.

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Section: Resultsmentioning

confidence: 99%

Directly Printed Interconnection Wires between Layers for 3D Integrated Stretchable Electronics

Sun

Zhang

Zhu

et al. 2022

Adv Materials Technologies

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“…We have demonstrated the application capability of electricfield-driven microscale 3D printing technology in our previous work. [51,52] In this work, we propose a new method for low-cost and simple fabrication of embedded metal mesh FTEs via a newly developed liquid substrate electric-field-driven (LS-EFD) microscale 3D printing. First, a layer of liquid material was spin coated on the surface of the flexible substrate, and then an ultrathin metal mesh with a large AR was printed directly on the liquid film substrate using LS-EFD microscale 3D printing technology.…”

Section: Introductionmentioning

confidence: 99%

Directly Printed Embedded Metal Mesh for Flexible Transparent Electrode via Liquid Substrate Electric‐Field‐Driven Jet

Zhu

et al. 2022

Advanced Science

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116

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Flexible transparent electrodes (FTEs) with embedded metal meshes play an indispensable role in many optoelectronic devices due to their excellent mechanical stability and environmental adaptability. However, low-cost, simple, efficient, and environmental friendly integrated manufacturing of high-performance embedded metal meshes remains a huge challenge. Here, a facile and novel fabrication method is proposed for FTEs with an embedded metal mesh via liquid substrateelectric-field-driven microscale 3D printing process. This direct printing strategy avoids tedious processes and offers low-cost and high-volume production, enabling the fabrication of high-resolution, high-aspect ratio embedded metal meshes without sacrificing transparency. The final manufactured FTEs with 80 mm × 80 mm embedded metal mesh offers excellent optoelectronic performance with a sheet resistance (R s ) of 6 𝛀 sq −1 and a transmittance (T) of 85.79%. The embedded metal structure still has excellent mechanical stability and good environmental suitability under different harsh working conditions. The practical feasibility of the FTEs is successfully demonstrated with a thermally driven 4D printing structure and a resistive transparent strain sensor. This method can be used to manufacture large areas with facile, high-efficiency, low-cost, and high-performance FTEs.

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“…More importantly, EFD microscale 3D printing also has considerable potential in micro/nanoscale 3D printing because a stable electric field can always be reformed between the nozzle and the printed object, ensuring stability and reliability of the 3D printing process. [57][58][59][60] In this work, we propose a new method for manufacturing high performance TGHs based on liquid sacrificial substrate electric-field-driven (LS-EFD) microscale 3D printing. First, a thin layer of liquid material was spin-coated on a glass substrate, and then the TFSP was printed directly onto the liquid film substrate using LS-EFD microscale 3D printing technology.…”

Section: Introductionmentioning

confidence: 99%

3D Printed High Performance Silver Mesh for Transparent Glass Heaters through Liquid Sacrificial Substrate Electric‐Field‐Driven Jet

et al. 2022

Small

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Transparent glass with metal mesh is considered a promising strategy for high performance transparent glass heaters (TGHs). However, the realization of simple, low‐cost manufacture of high performance TGHs still faces great challenges. Here, a technique for the fabrication of high performance TGHs is proposed using liquid sacrificial substrate electric‐field‐driven (LS‐EFD) microscale 3D printing of thick film silver paste. The liquid sacrificial substrate not only significantly improves the aspect ratio (AR) of silver mesh, but also plays a positive role in printing stability. The fabricated TGHs with a line width of 35 µm, thickness of 12.3 µm, and pitch of 1000 µm exhibit a desirable optoelectronic performance with sheet resistance (Rs) of 0.195 Ω sq−1 and transmittance (T) of 88.97%. A successful deicing test showcases the feasibility and practicality of the manufactured TGHs. Moreover, an interface evaporator is developed for the coordination of photothermal and electrothermal systems based on the high performance TGHs. The vapor generation rate of the device reaches 10.69 kg m−2 h−1 with a voltage of 2 V. The proposed technique is a promising strategy for the cost‐effective and simple fabrication of high performance TGHs.

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3D Printing of a PDMS Cylindrical Microlens Array with 100% Fill-Factor

Cited by 35 publications

References 52 publications

Directly Printed Interconnection Wires between Layers for 3D Integrated Stretchable Electronics

Directly Printed Interconnection Wires between Layers for 3D Integrated Stretchable Electronics

Directly Printed Embedded Metal Mesh for Flexible Transparent Electrode via Liquid Substrate Electric‐Field‐Driven Jet

3D Printed High Performance Silver Mesh for Transparent Glass Heaters through Liquid Sacrificial Substrate Electric‐Field‐Driven Jet

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