3D Printing Technology Toward State‐Of‐The‐Art Photoelectric Devices

Abstract

Photoelectric devices and components, as indispensable and increasingly significant technologies, are widely applied in energy conversion, electrocommunication, environmental detection, and so on. The rapid and accurate fabrication of optoelectronic devices and components brings severe challenges to the traditional preparation approaches. As a revolutionary emerging technology, 3D printing has unique advantages in geometric shape design and rapid prototyping in comparison with traditional manufacturing methods. Furthermore, it possesses excellent flexibility for fabrication methods and materials. To satisfy the fast‐expanding market of optoelectronic devices, the research in this field is showing an explosion of growth for 3D printing. However, systematic analysis and summary are still bleak about 3D printing in the photoelectric field despite abundant individual reports being presented. In order to point out its development status and forecast the future research direction, the relevant reports are summarized. Four categories of photoelectric devices are chosen as representative, including solar concentrators, solar cells, light emitting diodes, and photodetectors. In this article, the development and latest progress of 3D printing photoelectric devices are summarized as well as critical analyses of the challenges and opportunities are presented.

3D printed energy devices: generation, conversion, and storage

“…SCs are fabricated with several functional layers (e.g. photoactive layer, transport layer, buffer layer and back electrode layer), and each layer is closely connected, so facile and reliable fabrication methods are essential 40 . Mainstream methods such as spin coating, screen printing, scraping, and gravure printing have significant drawbacks, including uneven layer thickness and low uniformity.…”

3D Printing of Luminescent Perovskite Quantum Dot–Polymer Architectures

“…[12][13][14][15][16][17][18][19][20][21][22][23][24] An intriguing strategy to advance optoelectronic circuitries and devices is by vertically stacking them in 3D on non-planar surfaces to achieve a large aspect ratio for improving geometric scalability, increasing device efficacy, and further benefit device-integration technologies. [25][26][27] Several anticipated applications in next-generation electronics include wearable sensors, displays, and biomedical and energyconversion devices. The integration of optoelectronic components into 3D structures has the potential to improve the functionality of electronic devices in terms of their advanced electrical, optical, and mechanical properties.…”