1993
DOI: 10.1088/0960-1317/3/3/016
|View full text |Cite
|
Sign up to set email alerts
|

3D silicon electrostatic microactuator

Abstract: The fabrication of a 3D silicon linear microactuator is presented. This actuator is realized by anisotropic chemical etching of a (110) oriented silicon wafer. The silicon monolithic structure of the microactuator is constituted by a fixed part bonded on a glass substrate and a movable part suspended by two elastic beams. The displacement of the movable part is consequently frictionless and is obtained by electrostatic forces. Some mechanical and electrostatic tests are presented. Moreover, with the aim of usi… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
1

Citation Types

0
4
0

Year Published

1997
1997
2002
2002

Publication Types

Select...
2
1
1

Relationship

0
4

Authors

Journals

citations
Cited by 4 publications
(4 citation statements)
references
References 4 publications
0
4
0
Order By: Relevance
“…A frictionless electrostatic microactuator was described in [Tiro93] and [Tiro93a]. A frictionless electrostatic microactuator was described in [Tiro93] and [Tiro93a].…”
Section: Electrostatic Frictionless Microactuatormentioning
confidence: 99%
“…A frictionless electrostatic microactuator was described in [Tiro93] and [Tiro93a]. A frictionless electrostatic microactuator was described in [Tiro93] and [Tiro93a].…”
Section: Electrostatic Frictionless Microactuatormentioning
confidence: 99%
“…Several process technologies exist for the fabrication of high-aspect-ratio, single crystal silicon mechanical structures with more than one level (Albrecht et al, 1990;Tirole et al, 1993;Xu et al, 1995;Miller et al, 1997;Tirole et al, 1995). These processes usually involve SOI wafers, wafer bonding techniques or require self aligned levels (Hofmann et al, 1998).…”
Section: Introductionmentioning
confidence: 99%
“…Methods have been presented before for out of plane (Z directional) actuation (Albrecht et al, 1990;Tirole et al, 1993;Xu et al, 1995;Miller et al, 1997), but large displacements on the order of several microns have always been a problem due to the nature of the process and the actuation mechanism. This process produces high aspect ratio Z directional actuators with displacements of a few microns to several tens of microns.…”
Section: Introductionmentioning
confidence: 99%
“…Very often microactuators for MEMs are obtained simply by loading beams and plates with electrostatic forces controlled by applied voltages ( [1], [2], [3], [4], [5]). To study the mechanical behavior of the device a linear model generally can not give suitable results; in fact microfabrication techniques allow to design such devices on scales at which electrostatic loads can produce large deflections.…”
Section: Introduction and Reviewmentioning
confidence: 99%