“…Several process technologies exist for the fabrication of high-aspect-ratio, single crystal silicon mechanical structures with more than one level (Albrecht et al, 1990;Tirole et al, 1993;Xu et al, 1995;Miller et al, 1997;Tirole et al, 1995). These processes usually involve SOI wafers, wafer bonding techniques or require self aligned levels (Hofmann et al, 1998).…”