2021
DOI: 10.48550/arxiv.2104.04164
|View full text |Cite
Preprint
|
Sign up to set email alerts
|

3D Wireless Channel Modeling for Multi-layer Network on Chip

Chao Ren,
Jingze Hou,
Biao Pan

Abstract: The resource constraints and accuracy requirements for Internet of Things (IoT) memory chips need threedimensional (3D) monolithic integrated circuits, of which the increasing stack layers (currently more than 176) also cause excessive energy consumption and increasing wire length. In this paper, a novel 3D wireless network on chips (3DWiNoCs) model transmitting signal directly to the destination in arbitrary layer is proposed and characterized. However, due to the the reflection and refraction characteristics… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...

Citation Types

0
0
0

Publication Types

Select...

Relationship

0
0

Authors

Journals

citations
Cited by 0 publications
references
References 7 publications
0
0
0
Order By: Relevance

No citations

Set email alert for when this publication receives citations?