1998
DOI: 10.1049/el:19980337
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40 Gbit/s optical receiver module using a flip-chipbonding technique for device interconnection

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Cited by 27 publications
(4 citation statements)
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“…The coupling technology described here has also been applied to a 40-Gb/s hybrid WGPD-AMP [72] and a 72-GHz WGPD-based stimulus probe head [73]. These devices also demonstrated good efficiency, which indicates that this coupling technology is well-suited to WGPD's.…”
Section: Ultrawide-bandwidth Packagingmentioning
confidence: 83%
“…The coupling technology described here has also been applied to a 40-Gb/s hybrid WGPD-AMP [72] and a 72-GHz WGPD-based stimulus probe head [73]. These devices also demonstrated good efficiency, which indicates that this coupling technology is well-suited to WGPD's.…”
Section: Ultrawide-bandwidth Packagingmentioning
confidence: 83%
“…The remaining losses are therefore in the 3-5-dB range. We can attribute these losses to two factors, which are: 1) the flip-chip mounting of the photodiode give rise to RF losses because of a mismatch between the characteristic impedances of the photodiode and the gold pads [27] and 2) the distance between the PD and the MMIC is too important, leading to resonance in the frequency range of interest. Further experiments are thus necessary to fully control this new packaging technology.…”
Section: -Ghz Photoreceiver Modulesmentioning
confidence: 99%
“…Broadband photo receivers achieving high amplification as well as high bandwidth are usually combinations of small photodiodes with low parasitics and distributed amplifiers [1,2]. There have been also efforts to integrate photodiode and amplifier monolithically, resulting in complicated technological processes and sacrificing state of the art photodiode-structures [2,3,4,5,6].…”
Section: Introductionmentioning
confidence: 99%