“…I think that it is highly likely that a future oxide‐TFT material will contain tin as a constituent element, since incorporation of tin will allow oxide wet etchability to be dramatically engineered over a broad range of selectivity 10 . In this respect, recent industrial R&D involving ITZO 11 and IGZTO 12 , 13 is intriguing. Next, and most importantly, the flat‐panel‐display industry seems to have an insatiable desire for ever‐increasing TFT‐channel‐layer electron mobility (as well as hole mobility, if it could only get it).…”