55.2: A Novel Sn Paste Free Approach for Manufacturing Mini‐LED Display

Abstract

Mini/Micro LED are recognized as the fourth generation display technology due their superior performance. Backlights based on active‐matrix Mini‐LED (AM‐MLED) have been adopted in LCD modules and would soon be put into mass production. In this paper, a novel Sn paste free method was developed to manufacture Mini‐LED displays. This method is more simple and could successfully solve the short problem which is common for conventional approach. We believe this result would further extend the application of Mini‐LED in direct display area.

Process window of simultaneous transfer and bonding materials using laser‐assisted bonding for mini‐ and micro‐LED display panel packaging

“…In most assembly companies, the bonding process is performed separately after the device transfer process, either through a pick‐place process or an interpose process using an elastomer stamp [4]. The bonding process is carried out by a thermal or laser reflow process using conventional solder paste or anisotropic conductive films (ACF) [5]. The major bottlenecks of this two‐step process are the process yield and the reliability of the display panel.…”