2008
DOI: 10.1063/1.2985817
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6:1 aspect ratio silicon pillar based thermal neutron detector filled with B10

Abstract: Current helium-3 tube based thermal neutron detectors have shortcomings in achieving simultaneously high efficiency and low voltage while maintaining adequate fieldability performance. By using a three-dimensional silicon p-i-n diode pillar array filled with boron-10 these constraints can be overcome. The fabricated pillar structured detector reported here is composed of 2μm diameter silicon pillars with a 4μm pitch and height of 12μm. A thermal neutron detection efficiency of 7.3+∕−0.6% and a neutron-to-gamma… Show more

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Cited by 81 publications
(49 citation statements)
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“…To achieve the aspect ratios required, we employ nLOF 2035 negative photoresist, which produces a mask of ~2.8 μm in thickness. Etching is done in an STS DRIE Bosch system, using a process recipe composed of alternating fluorobutante (C 4 F 8 ) sidewall passivation and sulfur hexafluoride (SF 6 ) silicon etch steps [8]. Erosion of the photoresist mask is a potentially serious problem if the selectivity is not carefully controlled; an overall etch selectivity of >25:1 must be achieved to produce silicon pillar arrays of greater than 75 μm.…”
Section: Fabrication Of Boron Oxide Filled Pillar Arraymentioning
confidence: 99%
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“…To achieve the aspect ratios required, we employ nLOF 2035 negative photoresist, which produces a mask of ~2.8 μm in thickness. Etching is done in an STS DRIE Bosch system, using a process recipe composed of alternating fluorobutante (C 4 F 8 ) sidewall passivation and sulfur hexafluoride (SF 6 ) silicon etch steps [8]. Erosion of the photoresist mask is a potentially serious problem if the selectivity is not carefully controlled; an overall etch selectivity of >25:1 must be achieved to produce silicon pillar arrays of greater than 75 μm.…”
Section: Fabrication Of Boron Oxide Filled Pillar Arraymentioning
confidence: 99%
“…Common solid source deposition techniques, such as sputtering and e-beam evaporation, generally do not achieve a reasonable fill due to pinching off or shadowing effects at the tops of the pillars. While gaseous chemical vapor deposition is possible and has produced excellent results for our 10 B detectors [5][6][7][8][9][10], material precursors and deposition equipment can be expensive. As an alternative, we have developed processing capabilities to deliver 10 B 2 O 3 via a solution-based process to achieve near 100% fill.…”
Section: Solution Based Deposition Of 10 B 2 Omentioning
confidence: 99%
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“…We are currently investigating three dimensional P-I-N Si diode pillar arrays filled with isotopically enriched 10 Boron for thermal neutron detection. 7 In order to realize functionality of our devices, as well as similar three dimensional structures for other uses, it is necessary to make an electrical contact to the top of structure, which is the p+ layer of the diode. Achieving a blanket, conformal coating can be difficult due to topography across the device structure.…”
Section: Introductionmentioning
confidence: 99%