2024
DOI: 10.3788/cjl231495
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6.X nm下一代极紫外多层膜技术研究进展

李笑然 Li Xiaoran,
唐何涛 Tang Hetao,
赵娇玲 Zhao Jiaoling
et al.

Abstract: Significance The production of integrated circuits relies primarily on lithography. Extreme Ultraviolet (EUV) lithography employing a light source at 13.5 nm is currently the most advanced lithography technology for highvolume mass production, which has led to unprecedented progress in the development of integrated circuits (IC). The constant demand for IC chips with higher computing power has increased with the technological development of artificial intelligence in recent years. This requires further

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