2023
DOI: 10.1109/led.2023.3235777
|View full text |Cite
|
Sign up to set email alerts
|

702.3 A·cm⁻²/10.4 mΩ·cm² β-Ga₂O₃ U-Shape Trench Gate MOSFET With N-Ion Implantation

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1
1

Citation Types

0
12
0

Year Published

2023
2023
2025
2025

Publication Types

Select...
9

Relationship

1
8

Authors

Journals

citations
Cited by 27 publications
(12 citation statements)
references
References 29 publications
0
12
0
Order By: Relevance
“…16. Since the source regions were a) [60] . The CBL here was realized via oxygen annealing at 1200 °C for 6 h. The top access region with the thickness of 100 nm was then defined by the Si ion implantation.…”
Section: Cavets and Cbl Structurementioning
confidence: 99%
“…16. Since the source regions were a) [60] . The CBL here was realized via oxygen annealing at 1200 °C for 6 h. The top access region with the thickness of 100 nm was then defined by the Si ion implantation.…”
Section: Cavets and Cbl Structurementioning
confidence: 99%
“…This material has excellent conduction properties owing to an oxygen vacancy donor band 16 that belongs to a monoclinic structure with a space group of C2/m. 17 β-Ga 2 O 3 has gained significant attention in recent years because of its outstanding features and capabilities such as thermal stability (with a melting point of 1730 °C), 4,18 chemical and mechanical stability, 19 high breaking voltage (8 MV/cm), 20 and high Baliga's figure of merit (BFOM) (≈3000). 21 Diverse research groups have manufactured β-Ga 2 O 3 thin films, individual nanowires, array nanowires, and other nanostructures using numerous methods during the last few decades.…”
Section: Introductionmentioning
confidence: 99%
“…β-Ga 2 O 3 high-resistive p-like-well structures whose V th depends on the dopant concentration of deep acceptors such as nitrogen (N) [14][15][16] and magnesium (Mg) [16][17][18] have been investigated as alternative structures in which V th does not strongly depend on the recess depth or fin width. In particular, a lateral transistor using a thin Ndoped layer grown by molecular beam epitaxy 19) and a vertical U-shaped trench gate metal-oxide-semiconductor field-effect transistor (MOS FET) using an N-ion implantation layer 20) were reported to have normally-off characteristics. However, the former transistor operated only in the subthreshold region and the later transistor required a large positive gate-bias voltage (V gs ) of 25 V for operation due to a nonoptimized dose of N + implantation.…”
mentioning
confidence: 99%