82‐4: Late‐News Paper: Characterization of metal thin film‐wiring materials for foldable devices

Abstract

Bending durability is a crucial issue associated with materials for foldable devices. To fabricate gate electrodes, high bending resistance and thermal resistance are important requirements for metal films. This report is on Al-2.0at%Nd thin film, which exhibits excellent bending resistance and thermal stability, and is used to fabricate the gate electrodes for LTPS-TFTs.