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Seita, Masaru; Nawafune, Hidemi; Nishioka, T.; Mizumoto, Shozo; Kanai, Toshinobu

doi:10.1023/a:1015554625106

Cited by 15 publications

(14 citation statements)

References 1 publication

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“…The concentrations and temperatures applied in these two processes can be altered to produce the desired outcome. As such, the temperature and concentration of the different metal ions solutions were selected based on successful process conditions reported in the literature [5,12,16,[20][21][22]37]. To apply consistency between samples during the reduction process, the same reducing agent, NaBH4, was used using identical operational conditions for all metals.…”

Section: Reduction Of Metal Catalystsmentioning

confidence: 99%

“…The activation of a surface and the quality and success of subsequent metal deposition varies depending on the metal catalyst used [15]. Their concentration, temperature and processing time also influence the fabrication of high-quality circuitry by electroless plating [16]. The catalyst Pd has the highest catalytic activity and additionally shows the highest stability, which enables it to remain in its metallic state for longer to act as a catalyst [17,18].…”

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confidence: 99%

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Direct metallisation of polyetherimide substrates by activation with different metals

Jones

Ryspayeva

Esfahani

et al. 2019

Surface and Coatings Technology

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This article reports the performance of different metallic ions and nanoparticles (Ag, Cu, Ni, Pd, Cr, Co, Au and Fe) used as seed layers, formed by chemical or optical reduction, for the electroless Cu plating of metal tracks onto polyetherimide (PEI). Plated Cu performance was tested by adhesion, electrical conductivity, plating rate, XPS, SEM, XRD and EDX analysis. The application of Cu and Ag seeds resulted in high quality electroless Cu deposits presenting strong adhesion properties and high conductivity ((2.0 ± 0.5) ×10 7 S/m and (3.6 ± 0.2) ×10 7 S/m, respectively) compared with bulk copper (5.96 ×10 7 S/m). Performance is attributed to the high surface density and uniformity of seed layers. Of the metals, only Ag ions were photoreduced under the conditions applied and were subsequently used to electroless Cu plate high quality track features of 150 µm width. The application of sulphuric acid pre-treatment to PEI prior to Ag ion exchange, improved the photoinitiated track formation process, as demonstrated by a threefold increase to both photoinduced Ag nanoparticle density on the surface and electroless Cu plating rate, as well as improved electroless Cu adhesion to PEI.

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Section: Reduction Of Metal Catalystsmentioning

confidence: 99%

mentioning

confidence: 99%

Direct metallisation of polyetherimide substrates by activation with different metals

Jones

Ryspayeva

Esfahani

et al. 2019

Surface and Coatings Technology

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“…Processing steps presently employed for polyimide metallization are schematically presented in Figure 1. A hydrolysis reaction involving aqueous KOH solution was used to modify the polyimide surface to form carboxylic acid groups and secondary amine groups through cleavage of the imide rings 10. First, a polyimide film was immersed in an aqueous KOH solution (5 mol/L) for about 5 min at 50°C.…”

Section: Methodsmentioning

confidence: 99%

Surface modification and metallization of polyimide using gold colloids as a seed layer

Kong

Shao

Wang

et al. 2008

J of Applied Polymer Sci

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Herein we report on metallization of Cu on to surface-modified polyimide resin, the method of which relies on potassium hydroxide-induced modification of the polyimide surface to introduce carboxylic acid groups and incorporation of gold colloids as a seed layer through reduction of chloroauric acid. The contact angle of modified polyimide surface with water changed from 70 to 35 due to the hydrolysis of polyimide. Secondary amine group on the surface was detected with attenuated total reflection (ATR) Fourier transform infrared (FTIR) spectrophotometry, suggesting that tertiary amine group has turned into secondary group. In addition, on the basis of hydrophilic behavior, we succeeded in depositing gold colloids on the chemically modified surface. SEM image of copper electroless plated on polyimide surface indicated that copper particles were compact and about $ 300 nm in diameter. It showed that gold colloids provide an excellent conductive layer to catalyze the electroless plating of Cu on polyimide surface.

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“…2) has been demonstrated. 9,10 Immersion of PI film (Toray-Du Pont, Kapton 150EN-C) in aqueous 0.5 mol/dm 3 or 5.0 mol/dm 3 potassium hydroxide (KOH) solution at 50…”

Section: And L-lysine (Lys)mentioning

confidence: 99%

Electroless Plating Catalyst Performance of a Cationic Moiety Bearing Palladium Complex

Kohtoku

Honma

Takai

2014

J. Electrochem. Soc.

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Conventionally, in the electroless plating of resin, surface modification has been necessary to generate carboxylate moieties that enhances palladium catalyst adsorption. To further enhance palladium adsorption, a variety of Pd(II) amino acid complexes were synthesized, which bear a cationic pendant group with affinity for the carboxylate generated on the resin, and performance as an electroless plating catalyst evaluated. The Pd(II) complexes were characterized using UV-vis spectroscopy, revealing chelation of the amine and carboxylate groups of amino acids to Pd(II). For the Pd(II) complexes of Arginine or Lysine, affinity of the cationic pendant groups to resin surface carboxylate groups was suggested by enhanced Pd adsorption, c.a. 80 fold increase compared to complexes without cationic moieties. Furthermore, even under mild surface modification conditions with 0.5 mol/dm 3 KOH, the Pd(II) complexed with Arginine or Lysine displayed performance as a electroless Ni catalyst, allowing for electolytic copper plated laminates of 1 kN/m adhesion strenghth.

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Cited by 15 publications

References 1 publication

Direct metallisation of polyetherimide substrates by activation with different metals

Direct metallisation of polyetherimide substrates by activation with different metals

Surface modification and metallization of polyimide using gold colloids as a seed layer

Electroless Plating Catalyst Performance of a Cationic Moiety Bearing Palladium Complex

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