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Sahli, S.; Rebiai, S.; Raynaud, Patrice; Ségui, Y.; Zenasni, A.; Mouissat, Smail

doi:10.1023/a:1021329019189

Cited by 23 publications

(21 citation statements)

References 22 publications

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“…Infrared spectra of films deposited with TCMTS, TEOS and HMDSO at their respective maximum deposition rates of approximately 0.15 µm min 3400, 1150, 1075, 800 and 450 cm −1 , which are characteristic of PECVD silicon dioxide. On the other hand, with TMDSO and HMDSO, a C-H bending mode is observed at 1275 cm −1 , which is due to the presence of methyl groups attached to silicon [37,[39][40]. Also, the C-H stretching modes at ∼2900 cm −1 is observed in figure 4(b).…”

Section: Film Composition and Structurementioning

confidence: 94%

Chamberless plasma deposition of glass coatings on plastic

Nowling¹,

Yajima²,

Babayan³

et al. 2005

Plasma Sources Sci. Technol.

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A chamberless, remote plasma deposition process has been used to coat silicon and plastic substrates with glass at ambient conditions. The films were deposited by introducing an organosilane precursor into the afterglow of an atmospheric plasma fed with helium and 2 vol% oxygen. The precursors examined were hexamethyldisilazane, hexamethyldisiloxane, tetramethyldisiloxane, tetramethylcyclotetrasiloxane and tetraethoxysilane. With hexamethyldisilazane, glass films were deposited at rates of up to 0.25 µm min −1 and contained as little as 13.0 mol% hydroxyl groups. These films exhibited low porosity and superior hardness and abrasion resistance. With tetramethyldisiloxane, glass films were deposited at rates up to 0.91 µm min −1. However, these coatings contained significant amounts of carbon and hydroxyl impurities (∼20 mol% OH), yielding a higher density of voids and poor abrasion resistance. In summary, the properties of glass films produced by remote atmospheric plasma deposition strongly depend on the organosilane precursor selected.

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Section: Film Composition and Structurementioning

confidence: 94%

Chamberless plasma deposition of glass coatings on plastic

Nowling¹,

Yajima²,

Babayan³

et al. 2005

Plasma Sources Sci. Technol.

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“…However, according to the existing literature, there are still some information gaps concerning the contribution of additional (carrier or reactive) gases to plasma polymerization. Some authors have reported that the deposition rate is enhanced when non‐polymerizable gases are added to monomer gases during polymerization,4,5 while others found a less distinct tendency 6–8. Therefore, we are attempting to clarify this situation in the research reported in this paper by taking a macroscopic approach to plasma polymerization.…”

Section: Introductionmentioning

confidence: 90%

Influence of Non‐Polymerizable Gases Added During Plasma Polymerization

Hegemann

Hossain

2005

Plasma Processes & Polymers

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Summary: In plasma polymerization often additional, non‐polymerizable gases are used, either as carrier gas or as reactive co‐monomer. The gas ratio represents an additional parameter, which complicates the understanding of plasma polymerization processes. Therefore, we thoroughly investigated the deposition rates of different gas mixtures (O2/HMDSO, N2 and NH3/CxHy, as well as inert gas/CxHy) on the basis of a macroscopic approach. Since the mass deposition rates depend on the specific energy W/F, the plasma polymerization regime for the corresponding polymerizable monomer can be identified by introduction of a modified flow F = Fm + a Fc (sum of monomer flow Fm and carrier gas flow Fc with a flow factor a). Any deviations discovered during application of this novel approach indicate additional effects, such as ion‐induced effects.

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“…Varying ion bombardment by changing p is qualitatively illustrated in Figure 1:22 ion‐induced damage greatly increases by reducing p ; one may note three regimes (the pressure limits are only approximate): p < 70 mTorr, is characterized by a high [ions]/[neutrals] ratio. The collision frequency is quite low, and the flux of ions can be appreciable compared with that of neutrals (as also shown by Whittle et al), particularly if the reactor has magnetic confinement and can operate even below 1 mTorr 23, 24. Further, the ion energy is at a maximum; as a consequence, their physical effect in rearranging structure of the depositing material can be important.…”

Section: Effects Of Pressurementioning

confidence: 95%