“…The most common solid contact materials are polypyrrole (PPy), ,− polyaniline (PANI), − poly(3,4-ethylenedioxythiophene) (PEDOT), − and polythiophene derivatives, e.g., poly(3-octylthiophene) (POT). − They are usually electrochemically deposited on electrically conducting substrates (Au, Pt, or glassy carbon, GC) from aqueous solutions, although there are a few exceptions where organic solvents 18,35,37 or soluble CPs (PANI and POT) 24,27,36,38 have been used for the deposition of the inner solid contact layer. Water will always be present at the ISM|CP and CP|substrate interfaces after depositing the inner SC layer from aqueous solutions.…”