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Gusmano, G.; Bianco, Alessandra; Polini, Riccardo; Magistris, P.; Marcheselli, Giancarlo

doi:10.1023/a:1004894900840

Cited by 31 publications

(4 citation statements)

References 6 publications

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“…[20][21][22] Literature offers a large spectrum of processes that allow elaborating W-Cu composites. 23 Most commonly used methods are those involving liquid phase sintering by infiltration, 15 activated sintering, 24 powder melt, 25 and other slow, expensive and complex processes [26][27][28][29][30] like chemical synthesis for example. Factors that can affect their electrical and thermal conductivity are the composition, porosity, impurity level and grain size.…”

Section: Introductionmentioning

confidence: 99%

Copper coverage effect on tungsten crystallites texture development in W/Cu nanocomposite thin films

Girault¹,

Eyidi²,

Chauveau³

et al. 2011

Journal of Applied Physics

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Morphological and crystallographic structures of multilayered W/Cu nanocomposite thin films elaborated by physical vapor deposition were studied by varying copper and tungsten thicknesses. Sample examinations were performed by x-ray diffraction ͑XRD͒, grazing incidence small-angle x-ray scattering and transmission electron microscopy ͑TEM͒. Samples were found to be composed of copper nanoparticles, homogeneously dispersed in planes parallel to the film-substrate interface and periodically separated by tungsten layers along the growth direction. Our observations revealed an original texture development of the tungsten matrix from a mixture of unexpected ␣-W͗111͘ and ␣-W͗110͘ components to unique ␣-W͗110͘ component as the copper coverage passes a thickness threshold of 0.6 nm. Local TEM texture stereology investigations revealed simultaneous columnar growth of both preferential orientations posterior to polycrystalline development while XRD reveals strong compressive residual stresses in both texture components. Physical origins of the preferential crystallographic orientation evolution are discussed. Copper mono layers adsorption on W surfaces promotes surface energy anisotropy and diminution which is effective over the threshold. Below, the presence of a W͑Cu͒ solid solution which does not affect substantially the texture is revealed by the stress-free lattice parameter value extracted from XRD.

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Section: Introductionmentioning

confidence: 99%

Copper coverage effect on tungsten crystallites texture development in W/Cu nanocomposite thin films

Girault¹,

Eyidi²,

Chauveau³

et al. 2011

Journal of Applied Physics

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“…The fabrication of W-Cu materials that will outperform the properties of composites obtained via conventional methods is a peremptory challenge because of the great difference in melting points, lattice parameters and mutual insolubility between the two components. Various fabrication methods such as infiltration sintering, powder metallurgy, electroless plating, spark plasma infiltrating sintering were used to obtain W-Cu composites with improved characteristics [7][8][9][10][11][12]. Mechanical alloying (MA) and activated sintering in the presence of severe additives have been reported [13][14][15][16].…”

Section: Introductionmentioning

confidence: 99%

Fabrication of Cu-W Nanocomposites by Integration of Self-Propagating High-Temperature Synthesis and Hot Explosive Consolidation Technologies

Aydinyan

Kirakosyan

Zakaryan

et al. 2018

Eurasian Chem. Tech. J.

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Manufacturing W-Cu composite nanopowders was performed via joint reduction of CuO and WO3 oxides with various ratios (W:Cu = 2:1, 1:1, 1:3, 1:13.5) using combined Mg–C reducer. Combustion synthesis was used to synthesize homogeneous composite powders of W-Cu and hot explosive consolidation (HEC) technique was utilized to fabricate dense compacts from ultrafine structured W-Cu powders. Compact samples obtained from nanometer sized SHS powders demonstrated weak relation between the susceptibility and the applied magnetic field in comparison with the W and Cu containing micrometer grain size of metals. The density, microstructural uniformity and mechanical properties of SHS&HEC prepared samples were also evaluated. Internal friction (Q-1) and Young modulus (E) of fabricated composites studied for all samples indicated that the temperature 1000 °С is optimal for full annealing of microscopic defects of structure and internal stresses. Improved characteristics for Young modulus and internal friction were obtained for the W:Cu = 1:13.5 composite. According to microhardness measurement results, W-Cu nanopowders obtained by SHS method and compacted by HEC technology were characterized by enhanced (up to 85%) microhardness.

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“…1,2 In particular, copper-tungsten composites are widely used for thermal and electrical applications, such as heat sink materials for high density integrated circuits, high voltage electrical contact material and welding electrodes. [1][2][3][4][5][6] The Cu-W composites are preferred for such applications due to the fact that these composites provide high thermal conductivity along with excellent mechanical properties. [1][2][3][4][5][6] The high electrical and thermal conductivity of copper coupled with arc resistant and non-welding properties of tungsten provided an opportunity to develop an extensive series of compositions of Cu-W composites to achieve unique combination of properties for a particular application.…”

Section: Introductionmentioning

confidence: 99%

“…[1][2][3][4][5][6] The Cu-W composites are preferred for such applications due to the fact that these composites provide high thermal conductivity along with excellent mechanical properties. [1][2][3][4][5][6] The high electrical and thermal conductivity of copper coupled with arc resistant and non-welding properties of tungsten provided an opportunity to develop an extensive series of compositions of Cu-W composites to achieve unique combination of properties for a particular application. For example, the Cu-W composites with ,30 wt-%W have been found suitable for thermal management and electrical contacts material, whereas Cu-W composites with .30 wt-%tungsten have been found suitable for heavy duty applications such as resistance welding electrodes, air/oil immersed circuit breakers, arcing tips, heavy duty contractors and vacuum interrupters.…”

Section: Introductionmentioning

confidence: 99%

Synthesis and characterisation of Cu–W nanocomposite strips

Vajpai

Dube

Kanwat

et al. 2013

Materials Science and Technology

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The present work deals with the preparation of near full density Cu-5 wt-%W, Cu-20 wt-%Wand Cu-40 wt-%W nanocomposite strips from elemental copper and tungsten powders. The proposed route consists of preparing Cu-W nanocomposite powders via high energy ball milling of mixture of elemental powders followed by die compaction of the milled powder, sintering of the powder preforms at 1273 K and hot rolling of the unsheathed sintered preforms at 1273 K under protective atmosphere. The microstructural characteristics of the ball milled Cu-W composite powder as well as finished hot rolled strips of Cu-W composites have been investigated, and the mechanism underlying such microstructural evolution has been discussed. Ball milled composite powder particles as well as hot rolled finished Cu-W composite strips consisted of uniform distribution of submicrometre sized and nanosized tungsten particles embedded in the copper matrix. The microhardness of the finished Cu-W composite strips increased with increasing W content, whereas electrical conductivity decreased with increasing tungsten content in the finished Cu-W nanocomposite strips.

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Cited by 31 publications

References 6 publications

Copper coverage effect on tungsten crystallites texture development in W/Cu nanocomposite thin films

Copper coverage effect on tungsten crystallites texture development in W/Cu nanocomposite thin films

Fabrication of Cu-W Nanocomposites by Integration of Self-Propagating High-Temperature Synthesis and Hot Explosive Consolidation Technologies

Synthesis and characterisation of Cu–W nanocomposite strips

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