2001
DOI: 10.1023/a:1011054731371
|View full text |Cite
|
Sign up to set email alerts
|

Untitled

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2

Citation Types

5
49
0

Year Published

2005
2005
2011
2011

Publication Types

Select...
6

Relationship

1
5

Authors

Journals

citations
Cited by 53 publications
(54 citation statements)
references
References 58 publications
5
49
0
Order By: Relevance
“…1 for the functional form f 1 Acos 2 m for a facecentered cubic metal such as Al or Cu; the dimensionless parameters A, m (an integer parameter), and determine the strength of the anisotropy, symmetry due to surface crystallographic orientation, and misorientation of a fast surface diffusion direction with respect to the applied electric-field direction, respectively. This anisotropy function has given results in excellent qualitative agreement with experiments of void morphological evolution in metallic thin films under EM conditions [10,15]. The results of Fig.…”
supporting
confidence: 84%
See 4 more Smart Citations
“…1 for the functional form f 1 Acos 2 m for a facecentered cubic metal such as Al or Cu; the dimensionless parameters A, m (an integer parameter), and determine the strength of the anisotropy, symmetry due to surface crystallographic orientation, and misorientation of a fast surface diffusion direction with respect to the applied electric-field direction, respectively. This anisotropy function has given results in excellent qualitative agreement with experiments of void morphological evolution in metallic thin films under EM conditions [10,15]. The results of Fig.…”
supporting
confidence: 84%
“…For example, it has been demonstrated that a planar surface of a stressed elastic solid can evolve rapidly into a cusped surface, with smooth tops and deep cracklike grooves by surface diffusion [6], in agreement with experimental observations [7]. Moreover, dynamical simulations of electromigration (EM)-driven void morphological evolution in stressed metallic thin films demonstrated the formation of cracklike features emanating from void surfaces [8][9][10], including propagating faceted slits [9,10], due to an ATG instability. Recent theoretical work also addressed problems of EM-induced surface morphological evolution and stability of unstressed conductors and predicted the formation of various interesting surface features, including surface wave patterns [11,12], and complex oscillatory response of single-layer islands on crystalline substrates [13].…”
supporting
confidence: 69%
See 3 more Smart Citations