“…For example, it has been demonstrated that a planar surface of a stressed elastic solid can evolve rapidly into a cusped surface, with smooth tops and deep cracklike grooves by surface diffusion [6], in agreement with experimental observations [7]. Moreover, dynamical simulations of electromigration (EM)-driven void morphological evolution in stressed metallic thin films demonstrated the formation of cracklike features emanating from void surfaces [8][9][10], including propagating faceted slits [9,10], due to an ATG instability. Recent theoretical work also addressed problems of EM-induced surface morphological evolution and stability of unstressed conductors and predicted the formation of various interesting surface features, including surface wave patterns [11,12], and complex oscillatory response of single-layer islands on crystalline substrates [13].…”