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Abstract

Our findings suggest that tumor seeding along the stereotactic biopsy trajectory must be considered if an enhancing lesion appears in the MR image following the stereotactic biopsy. The cause and the prevention of implantation metastasis along the stereotactic biopsy tract are also discussed.

Copper electrocrystallization from acidic sulfate electrolyte containing MPS additive

“…Copper has been widely used as silicon chip interconnect material [1][2][3][4][5][6][7][8][9][10][11][12][13], and for on-chip metallization, damascene is a key technique. In the damascene process, trench and via cavities are first fabricated into a dielectric layer on the wafer.…”

“…To realize void-free electrodeposits, metal electroplating inside high aspect ratio trenches should preferentially occurs at the bottom of trenches. This process, usually called ''superfilling'' or ''superconformal,'' depends largely on the use of complex blends of additives in electrolytes [1][2][3][4][5][6][7][8][9][10][11][12][13]. A typical copper superfilling electrolyte consists of copper sulfate in an aqueous sulfuric acid solution, with the addition of combined additives.…”

“…The combined bath additives normally used are a three-component (accelerator, halide, and suppressor) or a four-component (accelerator, halide, suppressor, and leveler) additive package. Accelerators are typically sulfur-based organic molecules, such as 3-mercapto-1-propanesulfonate sodium salt (MPS) [2], which are also called 3-mercapto-1-propanesulfonic acid in some literatures [3][4][5][6], and bis-(3-sodiumsulfopropyl disulfide [6][7][8] (SPS). Typical suppressors are polyethers, such as polyethylene glycol (PEG) [7,[9][10][11][12] and polypropylene glycol [2].…”

“…For the leveling agents, thiourea, benzotriazole, and Janus Green B are often used [2,7]. It is generally regarded that superfilling should be theoretically carried out under an ideal additive distribution along the trench profile, where the suppressor is mainly adsorbed at the top of the trenches and simultaneously, the accelerator diffuses more easily than the suppressor and is mainly adsorbed at the bottom of the trenches [1][2][3][4][5][6][7]. Therefore, the trenches are filled from the bottom to the top without voids.…”

“…For electrolytes of a three-component additive package (chloride ions (Cl), PEG, and MPS), the inhibition effect is due to the interaction between the PEG-Cl and the copper surface [7,[9][10][11][12], and the acceleration effect is attributed to the competitive adsorption of MPS or its derivative [2][3][4][5][6][7][8]. MPS is a modest inhibitor when it is used solely in a copper bath [4,5]; nevertheless it with the presence of chloride ions accelerates the copper electrodeposition process [2][3][4][5][6].…”