1997
DOI: 10.1023/a:1018435720504
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Cited by 30 publications
(23 citation statements)
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“…The combined results indicate that zinc nucleation sites correlate to the surface roughness, and electrochemical properties. 6,[12][13][14] The displacement reaction between anodic aluminum and cathodic zinc ion continues at a considerably fast rate, resulting in the formation of large zinc particles near the dissolution holes as seen in Fig. 5.…”
Section: Resultsmentioning
confidence: 99%
“…The combined results indicate that zinc nucleation sites correlate to the surface roughness, and electrochemical properties. 6,[12][13][14] The displacement reaction between anodic aluminum and cathodic zinc ion continues at a considerably fast rate, resulting in the formation of large zinc particles near the dissolution holes as seen in Fig. 5.…”
Section: Resultsmentioning
confidence: 99%
“…For example, tin/lead immersion coatings on Cu (from baths containing appropriate complexing agents) [20] and gold or silver immersion coatings on Cu (sometimes coupled with Ni electroless plating) [21][22][23] are common practice in PCB fabrication. Also, Zn and Cu immersion coatings on aluminum have been used for anticorrosion, primer plating, or decorative purposes [24][25][26]. Finally, Cu immersion plating has been used for corrosion protection of stainless steel substrates [27].…”
Section: Metal Finishing the Electronics Industry And Metallurgicalmentioning
confidence: 99%
“…Steel-based materials were selected to study the properties of zinc deposit [36]. Aluminum was also utilized in studies involving zincate reaction processes [37] and zinc nucleation and growth [38]. Inspired by its use in the treatment of cast alloys, Al-Si was studied in its relation to zincate chemistry and the precipitation sequence of Cu, Fe, Ni and Zn in zincate solution [39].…”
Section: Negative and Positive Electrode Materialsmentioning
confidence: 99%