A 1.4V, 2.4/5 GHz, 90nm CMOS System in a Package Transceiver for Next Generation WLAN

Up-conversion mixers in a complementary 0.4 μm SiGe process

“…Mixer with the folded input did not improve mixer TDR, however its use should be considered with lower supply voltages. The CMOS version of the current feedback topology has been used in [14] for WLAN transmitter purposes.…”

A 5GHz class-AB power amplifier in 90nm CMOS with digitally-assisted AM-PM correction

“…A thin-gate device was used as a driver in the first stage to increase the gain without compromising reliability. The microstrip matching network of the PA was implemented on the top layer of a 6-layer flip-chip package nd transforms the 50 load impedance to approximately 12 [5].…”

“…The PA described in this work is part of the integrated WLAN transceiver presented in [5]. One of the most important concerns in the integration of a PA on the same die as the rest of the transceiver is coupling from the PA to sensitive lines, e.g.…”

“…VCO. A number of techniques were used to minimize such undesired coupling: the VCO operates at a frequency non-harmonically related to the RF frequency [5]; CMOS rail-to-rail inverters, rather than LC-loaded amplifiers, were used to buffer the local oscillator signals; the PA supplies were separated from the rest of the transceiver; extensive decoupling was used on supplies and bias lines; high-resistivity isolation layers and large numbers of substrate contacts were used to minimize substrate coupling; differential routing was used throughout the chip.…”

“…In a real application the control signal would be generated in the DSP preceding the RF front-end. The LO signal was generated by an on-chip PLL as described in [5]. EVM measurements were performed with a vector signal analyzer.…”