A 1-mm 50 k-Pixel IT CCD image sensor for miniature camera system

Itakura, K.; Nobusada, T.; Kokusenya, N.; Nagayoshi, R.; Ozaki, Ryushi

doi:10.1109/16.817568

Cited by 9 publications

(3 citation statements)

References 1 publication

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“…Modern optical imaging-based research and industrial systems rely on the use of bulky and expensive objective lenses. Despite their superior performance in resolving submicron features under low-light conditions, these lenses can detect only one sample at a time (which lies within their field of view (FOV)), while manufacturing limitations do not allow miniaturization and integration with emerging micromachined devices, including miniature CCD sensors [1], photonic chips [2] and microfluidic biochips [3]. The development of onchip lens-based optical modules entails the miniaturization of these lenses while maintaining superb imaging quality.…”

Section: Introductionmentioning

confidence: 99%

A doublet microlens array for imaging micron-sized objects

Chronis

2011

J. Micromech. Microeng.

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We present a high-numerical aperture, doublet microlens array for imaging micron-sized objects. The proposed doublet architecture consists of glass microspheres trapped on a predefined array of silicon microholes and covered with a thin polymer layer. A standard silicon microfabrication process and a novel fluidic assembly technique were combined to obtain an array of 56 μm diameter microlenses with a numerical aperture of ~0.5. Using such an array, we demonstrated brightfield and fluorescent image formation of objects directly on a CCD sensor without the use of intermediate lenses. The proposed technology is a significant advancement toward the unmet need of inexpensive, miniaturized optical modules which can be further integrated with lab-on-chip microfluidic devices and photonic chips for a variety of high-end imaging/detection applications.

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Section: Introductionmentioning

confidence: 99%

A doublet microlens array for imaging micron-sized objects

Chronis

2011

J. Micromech. Microeng.

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“…A great quantity of polymeric microlens arrays can be fabricated using micro-compression, injection molding, or hot embossing by using the electroformed mold inserts of microlens array. Furthermore, polymeric microlens arrays are applied to the charge-coupled-device (CCD) cameras [6], optical scanners, fiber interconnects [7,8,9], copiers [10], liquid-crystal displays (LCDs), and personal digital accessories (PDAs) applications.…”

Section: Introductionmentioning

confidence: 99%

Concave microlens array mold fabrication in photoresist using UV proximity printing

2006

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This paper presents a simple and effective method to fabricate a polydimethyl-siloxane (PDMS) microlens array with a high fill factor, which utilizes the UV proximity printing and photoresist replication methods. The concave microlens array mold was made using a printing gap in lithography process, which utilizes optical diffraction of UV light to deflect away from the aperture edges and produces a certain exposure in the photoresist material outside the aperture edges. This method can precisely control the geometric profile of concave microlens array. The experimental results showed that the concave micro-lens array in photoresist could be formed automatically when the printing gap ranged from 240 μm to 720 μm. High fill factor microlens array can be produced, when the control pitch distance between the adjacent apertures of the concave microlens array was decreased to the aperture size.

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“…Microlenses have become important in the development of laser-beam application systems such as optical communication systems and optical signal processing systems [1]. The optical components in current devices applications include CCD image sensors [2], fibre coupling [3,4] and copying machines [5]. These diverse applications promote many new methods discussed by researchers related to microlens array fabrication.…”

Section: Introductionmentioning

confidence: 99%

High fill-factor microlens array mold insert fabrication using a thermal reflow process

Yang

Chao

Wei

et al. 2004

J. Micromech. Microeng.

153

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An extreme high fill-factor microlens array mold insert in photoresist fabrication using a thermal reflow process is presented. The experimental results proved that a square microlens array could be produced without a peripheral gap. A square microlens array with an extreme high fill-factor (almost 100%) was successfully fabricated. In this experiment, square photoresist columns were formed on a silicon substrate using a lithographic process. The square pattern was laid out in an ortho-square on a polyethylene terephthalate (PET) based mask. Precise temperature and time control was used during the thermal reflow process. The square microlens array was formed from the uniformly flowing melted photoresist. The photoresist column surface transforms into a spherical profile due to the surface tension effect. The error was within ±8% between the fabricated microlens characteristics and the theoretical model used to predict the photoresist column thickness and actual thickness. This model is feasible for fabricating various sized high fill-factor square microlens arrays.

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A 1-mm 50 k-Pixel IT CCD image sensor for miniature camera system

Cited by 9 publications

References 1 publication

A doublet microlens array for imaging micron-sized objects

A doublet microlens array for imaging micron-sized objects

Concave microlens array mold fabrication in photoresist using UV proximity printing

High fill-factor microlens array mold insert fabrication using a thermal reflow process

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