2020
DOI: 10.1109/tmtt.2020.2989112
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A 150-GHz Transmitter With 12-dBm Peak Output Power Using 130-nm SiGe:C BiCMOS Process

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Cited by 20 publications
(8 citation statements)
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“…Therefore, the input and output interface of the channel emulator should have better robustness so that it can be directly connected with the transceiver or instrument. In mm-wave low-frequency bands (below 30 GHz), interfaces such as instrument or RF transceiver outputs typically use coaxial connectors [ 20 ]. When the frequency is higher than 50 GHz, the instrument interface is usually designed as a waveguide interface for more favorable stability and cost.…”
Section: Packaging Methodologymentioning
confidence: 99%
“…Therefore, the input and output interface of the channel emulator should have better robustness so that it can be directly connected with the transceiver or instrument. In mm-wave low-frequency bands (below 30 GHz), interfaces such as instrument or RF transceiver outputs typically use coaxial connectors [ 20 ]. When the frequency is higher than 50 GHz, the instrument interface is usually designed as a waveguide interface for more favorable stability and cost.…”
Section: Packaging Methodologymentioning
confidence: 99%
“…Fig. 3 [ 27 ] shows some typical THz power amplifiers based on silicon‐based process [ 70–91 ] . In 2014, Professor Payam Heydari’s research group at the University of California, Irvine designed a PA with an operating frequency of 210 GHz and an output power of 4.6 dBm based on a 32 nm SOI CMOS process [ 73 ] .…”
Section: Silicon‐based Thz Power Amplifiermentioning
confidence: 99%
“…The PA unit cells are based on the neutralized common source unit-cell topology [11][12], the neutralization capacitor is optimized to the balance the stability and gain [13][14]. The unit cell transistors are biased at the optimal current density of Jopt=217.4μA/μm [15].…”
Section: Power Combiner Considerationmentioning
confidence: 99%