2018
DOI: 10.1109/ted.2017.2779790
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A $256\times256$ , 100-kfps, 61% Fill-Factor SPAD Image Sensor for Time-Resolved Microscopy Applications

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Cited by 84 publications
(57 citation statements)
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“…State of the art SPAD pixel arrays that are commercially available today consist of thousands of pixels with row or column multiplexed readout capabilities and do not support fully parallel readout. Current SPAD arrays also have very low fill factors due to the need of integrating counting and storage electronics within each pixel [32,33]. Our method and results make a case for developing high resolution fabrication and 3D stacking techniques that will enable high fill-factor SPAD arrays, which can be used as general purpose, passive sensors for applications requiring extreme dynamic range imaging.…”
Section: Discussionmentioning
confidence: 96%
“…State of the art SPAD pixel arrays that are commercially available today consist of thousands of pixels with row or column multiplexed readout capabilities and do not support fully parallel readout. Current SPAD arrays also have very low fill factors due to the need of integrating counting and storage electronics within each pixel [32,33]. Our method and results make a case for developing high resolution fabrication and 3D stacking techniques that will enable high fill-factor SPAD arrays, which can be used as general purpose, passive sensors for applications requiring extreme dynamic range imaging.…”
Section: Discussionmentioning
confidence: 96%
“…Other techniques for SPADs time-gating were proposed in the following years; some examples can be found in Refs. [80][81][82][83][84][85][86][87][88][89][90][91][92]. However, it is worth noting that: (i) none of them (apart the one proposed in Ref.…”
Section: Other Solutions For Spads Time-gatingmentioning
confidence: 99%
“…Recent progress in the design and manufacturing processes of CMOS based SPAD arrays led to sub-megapixel arrays [54], low DCR and improved photon detection efficiency (PDE) [24,57]. This has been achieved by a synergy between innovative SPAD designs, process improvements and 3D integrated circuit (IC) technology advancements.…”
Section: Crosstalk Characterizationmentioning
confidence: 99%