A 25mW CMOS sensor for wind and temperature measurement

Wu, Jianfeng; Vroonhoven, Caspar van; Chae, Youngcheol; Makinwa, Kofi A. A.

doi:10.1109/icsens.2011.6127204

Cited by 27 publications

(7 citation statements)

References 4 publications

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“…During combustion, an extensive variety of particulate matter (PM) is released, alongside gases [35,36]. The relative proportions of these quantities vary depending on the fuel source and environmental characteristics [13].…”

Section: Particulate Mattermentioning

confidence: 99%

Downwind Fire and Smoke Detection during a Controlled Burn—Analyzing the Feasibility and Robustness of Several Downwind Wildfire Sensing Modalities through Real World Applications

Chwalek,

Chen,

Dutta

et al. 2023

Fire

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Wildfires have played an increasing role in wreaking havoc on communities, livelihoods, and ecosystems globally, often starting in remote regions and rapidly spreading into inhabited areas where they become difficult to suppress due to their size and unpredictability. In sparsely populated remote regions where freshly ignited fires can propagate unimpeded, the need for distributed fire detection capabilities has become increasingly urgent. In this work, we evaluate the potential of a multitude of different sensing modalities for integration into a distributed downwind fire detection system, something which does not exist today. We deployed custom sensor-rich data logging units over a multi-day-controlled burn event hosted by the Marin County Fire Department in Marin County, CA. Under the experimental conditions, nearly all sensing modalities exhibited signature behaviors of a nearby active fire, but with varying degrees of sensitivity. We present promising preliminary findings from these field tests but also note that future work is needed to assess more prosaic concerns. Larger scale trials will be needed to determine the practicality of specific sensing modalities in outdoor settings, and additional environmental data and testing will be needed to determine the sensor system lifetime, data delivery performance, and other technical considerations. Crucially, this work provides the preliminary justification underscoring that future work is potentially valuable and worth pursuit.

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Section: Particulate Mattermentioning

confidence: 99%

Downwind Fire and Smoke Detection during a Controlled Burn—Analyzing the Feasibility and Robustness of Several Downwind Wildfire Sensing Modalities through Real World Applications

Chwalek,

Chen,

Dutta

et al. 2023

Fire

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“…Those designs can reduce power consumption by suppressing unwanted lateral heat conduction in the substrate. In terms of packaging, the chip is always filled with glue and the backside is used as a sensing surface [ 9 , 10 ]. This can protect the devices to a certain extent and guarantee the robustness of the sensor.…”

Section: Introductionmentioning

confidence: 99%

Research on Dust Effect for MEMS Thermal Wind Sensors

Wang

Qin

et al. 2023

Sensors

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This communication investigated the dust effect on microelectromechanical system (MEMS) thermal wind sensors, with an aim to evaluate performance in practical applications. An equivalent circuit was established to analyze the temperature gradient influenced by dust accumulation on the sensor’s surface. The finite element method (FEM) simulation was carried out to verify the proposed model using COMSOL Multiphysics software. In experiments, dust was accumulated on the sensor’s surface by two different methods. The measured results indicated that the output voltage for the sensor with dust on its surface was a little smaller than that of the sensor without dust at the same wind speed, which can degrade the measurement sensitivity and accuracy. Compared to the sensor without dust, the average voltage was reduced by about 1.91% and 3.75% when the dustiness was 0.04 g/mL and 0.12 g/mL, respectively. The results can provide a reference for the actual application of thermal wind sensors in harsh environments.

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“…The second class relies on the back surface of the sensor to interact thermally with the airflow [23][24][25][26][27][28][29][30][31][32][33][34][35]. In these thermal wind sensors, ceramic is considered a proper material for the packaging because of its moderate heat conduction and stable mechanical properties.…”

Section: Introductionmentioning

confidence: 99%

“…In these thermal wind sensors, ceramic is considered a proper material for the packaging because of its moderate heat conduction and stable mechanical properties. On one hand some thermal wind sensors were first fabricated on silicon substrates and then packaged by using ceramic substrates [23][24][25][26][27][28][29][30]. Makinwa and Huijsing first fabricated the thermal wind sensor on a bulk silicon substrate and then glued it on the backside of a thin ceramic carrier [23].…”

Section: Introductionmentioning

confidence: 99%

“…However, given that the bulk silicon substrate has an isotropic thermal conductivity (approximately 130 W m•K −1 ), the power consumption of the sensor reached as much as 600 and 450 mW, when the sensor was respectively operated in the constant power (CP) mode [24] and the constant temperature difference (CTD) mode [25]. To address this issue, a high-order TΣΔ modulator and system-level chopping technology were introduced into the interface circuit and the power consumption of the sensor was eventually reduced to 50 and 25 mW [26,27]. However, if the sensor chip is not bonded in the center of the ceramic plate, the output signals will be distorted [28].…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Development of a self-packaged 2D MEMS thermal wind sensor for low power applications

Zhu

Chen

Qin

et al. 2015

J. Micromech. Microeng.

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This article describes the design, fabrication, and testing of a self-packaged 2D thermal wind sensor. The sensor consists of four heaters and nine thermistors. A central thermistor senses the average heater temperature, whereas the other eight, which are distributed symmetrically around the heaters, measure the temperature differences between the upstream and downstream surface of the sensor. The sensor was realized on one side of a silicon-in-glass (SIG) substrate. Vertical silicon vias in the substrate ensure good thermal contact between the sensor and the airflow and the glass effectively isolates the heaters from the thermistors. The substrate was fabricated by using a glass reflow process, after which the sensor was realized by a lift-off process. The sensor’s geometry was investigated with the help of simulations. These show that narrow heaters, moderate heater spacing, and thin substrates all improve the sensor’s sensitivity. Finally, the sensor was tested and calibrated in a wind tunnel by using a linear interpolation algorithm. At a constant heating power of 24.5 mW, measurement results show that the sensor can detect airflow speeds of up to 25 m s−1, with an accuracy of 0.1 m s−1 at low speeds and 0.5 m s−1 at high speeds. Airflow direction can be determined in a range of 360° with an accuracy of ±6°.

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A 25mW CMOS sensor for wind and temperature measurement

Cited by 27 publications

References 4 publications

Downwind Fire and Smoke Detection during a Controlled Burn—Analyzing the Feasibility and Robustness of Several Downwind Wildfire Sensing Modalities through Real World Applications

Downwind Fire and Smoke Detection during a Controlled Burn—Analyzing the Feasibility and Robustness of Several Downwind Wildfire Sensing Modalities through Real World Applications

Research on Dust Effect for MEMS Thermal Wind Sensors

Development of a self-packaged 2D MEMS thermal wind sensor for low power applications

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