“…162 In alternative to flexible substrates manufactured independently from the TFTs, it is also possible to create the flexible substrate by covering a host substrate with a polymer using either evaporation, 80,81,141 spin, slot or blade coating techniques. 23,39,133,135,137,142,144,147,155,161,164,179 The advantages of these fabrication techniques based on a rigid support are a high compatibility with the standard fabrication processes on Si or glass wafers, a reduction of the expansion of the substrate during the manufacturing process, as well as the possibility to realize devices on very thin (%1 lm) substrates. After the TFT fabrication is completed, the flexible foils or thin deposited polymer layers carrying the devices can be separated from the rigid support using: (1) mechanical peeling, 38,142,155,158,161,164,166,168,179 (2) a low adhesion releasing layer, 133,144 (3) a supporting laser, 137 or (4) a sacrificial layer between the host carrier and the polymer.…”