2013
DOI: 10.1002/j.2168-0159.2013.tb06177.x
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A 3.4‐in. Flexible High‐Resolution Full‐Color Top‐Emitting AMOLED Display

Abstract: In this paper, we report a 3.4‐inch flexible top‐emitting AMOLED display with remarkably high resolution using oxide TFTs. Our transfer technology has an advantage of fabricating high‐performance TFTs and a high‐resolution AMOLED Display on a flexible substrate.

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Cited by 44 publications
(41 citation statements)
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“…162 In alternative to flexible substrates manufactured independently from the TFTs, it is also possible to create the flexible substrate by covering a host substrate with a polymer using either evaporation, 80,81,141 spin, slot or blade coating techniques. 23,39,133,135,137,142,144,147,155,161,164,179 The advantages of these fabrication techniques based on a rigid support are a high compatibility with the standard fabrication processes on Si or glass wafers, a reduction of the expansion of the substrate during the manufacturing process, as well as the possibility to realize devices on very thin (%1 lm) substrates. After the TFT fabrication is completed, the flexible foils or thin deposited polymer layers carrying the devices can be separated from the rigid support using: (1) mechanical peeling, 38,142,155,158,161,164,166,168,179 (2) a low adhesion releasing layer, 133,144 (3) a supporting laser, 137 or (4) a sacrificial layer between the host carrier and the polymer.…”
Section: Fabrication Techniquesmentioning
confidence: 99%
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“…162 In alternative to flexible substrates manufactured independently from the TFTs, it is also possible to create the flexible substrate by covering a host substrate with a polymer using either evaporation, 80,81,141 spin, slot or blade coating techniques. 23,39,133,135,137,142,144,147,155,161,164,179 The advantages of these fabrication techniques based on a rigid support are a high compatibility with the standard fabrication processes on Si or glass wafers, a reduction of the expansion of the substrate during the manufacturing process, as well as the possibility to realize devices on very thin (%1 lm) substrates. After the TFT fabrication is completed, the flexible foils or thin deposited polymer layers carrying the devices can be separated from the rigid support using: (1) mechanical peeling, 38,142,155,158,161,164,166,168,179 (2) a low adhesion releasing layer, 133,144 (3) a supporting laser, 137 or (4) a sacrificial layer between the host carrier and the polymer.…”
Section: Fabrication Techniquesmentioning
confidence: 99%
“…144 To increase the mechanical stability or to realize electronic devices on alternative surfaces, thin flexible substrates have also been transferred and attached to a new carrier like PI or organic tissues. 38,39,78,80,81,141 Finally, it is also possible to fabricate TFTs directly on a rigid carrier coated with a sacrificial layer and subsequently transfer only the devices onto a flexible substrate. 38,78,82,205 In addition to the different handling possibilities, the substrate preparation typically includes a heat treatment step prior to the device fabrication itself.…”
Section: Fabrication Techniquesmentioning
confidence: 99%
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