A 3D micro-channel cooling system embedded in LTCC packaging substrate

Songtao, Jia; Miao, Min; Fang, Runiu; Guo, Shichao; Hu, Duwei; Jin, Yufeng

doi:10.1109/nems.2012.6196859

Cited by 9 publications

(5 citation statements)

References 3 publications

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“…Therefore, the thermal management analysis has been carried out at the preliminary stage of the manufacturing and design of the new devices and technologies. LTCC technology via small channels with flowing coolant allows a promising solution for improving heat dissipation and for decreasing the limited high temperature from the power chip for the reason of the advantages such as the small coefficient of thermal expansion (CTE), easiness to create 3D micro structure, low firing temperature and high density device integration capability [5][6][7]17]. Cooling of power electronic devices is dependent on quality of joint between power chips and ceramic substrates.…”

Section: Introductionmentioning

confidence: 99%

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Simulation of cooling efficiency via miniaturised channels in multilayer LTCC for power electronics

Pietriková

Girasek

Lukács

et al. 2017

Journal of Electrical Engineering

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The aim of this paper is detailed investigation of thermal resistance, flow analysis and distribution of coolant as well as thermal distribution inside multilayer LTCC substrates with embedded channels for power electronic devices by simulation software. For this reason four various structures of internal channels in the multilayer LTCC substrates were designed and simulated. The impact of the volume flow, structures of channels, and power loss of chip was simulated, calculated and analyzed by using the simulation software Mentor Graphics FloEFD TM . The structure, size and location of channels have the significant impact on thermal resistance, pressure of coolant as well as the effectivity of cooling power components (chips) that can be placed on the top of LTCC substrate. The main contribution of this paper is thermal analyze, optimization and impact of 4 various cooling channels embedded in LTCC multilayer structure. Paper investigate, the effect of volume flow in cooling channels for achieving the least thermal resistance of LTCC substrate that is loaded by power thermal chips. Paper shows on the impact of the first chips thermal load on the second chip as well as. This possible new technology could ensure in the case of practical realization effective cooling and increasing reliability of high power modules.

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Section: Introductionmentioning

confidence: 99%

“…However, the poor thermal conductivity (which is about 3 to 5 Wm-1K-1) limits their application for power electronic devices [5][6]. For this reason, the poor thermal conductivity of LTCC has to be improved by a coolant, which is pumped through the fluidic channels inside the LTCC devices [1-3, 6-7, 9].…”

Section: Introductionmentioning

confidence: 99%

Simulation of cooling efficiency via miniaturised channels in multilayer LTCC for power electronics

Pietriková

Girasek

Lukács

et al. 2017

Journal of Electrical Engineering

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show abstract

“…LTCC technology via small channels allows a promising solution for improving heat dissipation and for decreasing the limited high temperature from the power chip. However, the poor thermal conductivity (which is about 3 to 5 Wm -1 K -1 ) limits their application for power electronic [5,6]. For this reason the poor thermal conductivity of LTCC has to be improved by a coolant, which is pumped through the fluidic channels inside the LTCC devices [1,3,4,6,7,8].…”

Section: Introductionmentioning

confidence: 99%

“…However, the poor thermal conductivity (which is about 3 to 5 Wm -1 K -1 ) limits their application for power electronic [5,6]. For this reason the poor thermal conductivity of LTCC has to be improved by a coolant, which is pumped through the fluidic channels inside the LTCC devices [1,3,4,6,7,8]. Integrated microchannel cooling system in LTCC substrate can decrease the additional temperature more than 80 % [20].…”

Section: Introductionmentioning

confidence: 99%

Simulation of Heat Transfer by Cooling Channels in LTCC Substrate

Girasek¹,

Pietriková²,

Welker³

et al. 2017

AEI

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The thermal resistance, flow analysis, pressure drop and distribution of coolant inside multilayer LTCC (Low Temperature Co-fired Ceramics) substrate are detailed investigated in this paper. For this reason four various structures of internal channels in the multilayer LTCC substrates were designed and simulated. The simulation 3D model consist of 6 LTCC of DuPont 951 ® layer with cooling microchannel in middle of substrate, power chips paced on top of LTCC and silver sintered joints under power chips. The impact of the structure of channels, volume flow and power loss of die was simulated, calculated and analyzed by using the simulation software Mentor Graphics FloEFD TM. The structure and size of channels have the significant impact on thermal resistance, pressure of coolant as well as the effectivity of cooling power components which can be placed on LTCC substrate. The thermal resistance was calculated from the temperature gradient among chip junction, the inlet fluid and the thermal load of chip. Optimizing and comparison of cooling channels structure inside LTCC substrates and analyzing the effect of volume flow for achieving the least thermal resistance of LTCC multilayer substrate is the main contribution of this paper.

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“…However, LTCC permits the achievement of higher thermal conductivity, the fabrication of heaters with a very wide range of resistances, the integration of buried fluid channels directly with multilayer electronic boards, and the manufacturing of thick‐film passive electronic components. This means LTCC enables the manufacturing of integrated active cooling systems with better thermal performances …”

Section: Introductionmentioning

confidence: 99%

LTCC Temperature Controller

Jurków

2015

Int J Applied Ceramic Tech

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The dynamic development of the integration of modern electronics caused thermal management to be one of the key issues in novel electronic designing. The paper aimed to present one of the solutions, which can be very useful in the thermal management on the level of cooling electronic boards. This paper presents the design, simulation, technology, and performances of active low temperature co-fired ceramic (LTCC) temperature controllers. Moreover, it discusses the limitation of LTCC in such applications.

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A 3D micro-channel cooling system embedded in LTCC packaging substrate

Cited by 9 publications

References 3 publications

Simulation of cooling efficiency via miniaturised channels in multilayer LTCC for power electronics

Simulation of cooling efficiency via miniaturised channels in multilayer LTCC for power electronics

Simulation of Heat Transfer by Cooling Channels in LTCC Substrate

LTCC Temperature Controller

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