A boundary tracking approach for tape substrate pattern inspection based on skeleton information

Defect Classification Using Bayesian Approach for Tape Substrate Inspection System

“…In case of l a or l e , they have one link and one terminal point, which is less than two link point of its corresponding pattern l 1 , and therefore are decided as open defects. The graph matching method is described in detail in reference (Roh et al, 2006). In addition to the critical open or short defects, TS products can have latent defects such as nick and protrusion caused by over and under etching, respectively.…”