2022
DOI: 10.1109/lmwc.2022.3140267
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A Broadband E-Band Single-Layer-SIW-to-Waveguide Transition for Automotive Radar

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Cited by 11 publications
(5 citation statements)
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“…Furthermore, Li and Luk [34] employ a complex configuration with an increased number of blind vias in a three-layered stackup, which makes the design costly and prone to manufacturing misalignment. As it can be observed, the proposed solution in this work is the only PCB-based one, which is compatible with MMIC integration through GCPW termination, which is not the case for the SIW terminated designs reported in [33] and [34], resulting in an estimated more losses associated with SIW to MMIC transitions.…”
Section: Experimental Investigationmentioning
confidence: 91%
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“…Furthermore, Li and Luk [34] employ a complex configuration with an increased number of blind vias in a three-layered stackup, which makes the design costly and prone to manufacturing misalignment. As it can be observed, the proposed solution in this work is the only PCB-based one, which is compatible with MMIC integration through GCPW termination, which is not the case for the SIW terminated designs reported in [33] and [34], resulting in an estimated more losses associated with SIW to MMIC transitions.…”
Section: Experimental Investigationmentioning
confidence: 91%
“…12 (bottom view). Perfectly sealed and hermetic designs are reported in [18], [32], [33], and [34]. Yet, [33] requires a tapered metallic transition to be compatible with standard WR12.…”
Section: Experimental Investigationmentioning
confidence: 99%
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“…Up to now, transition structures from SIW to standard RWG have been divided into two categories. The first is vertically connected structures, including some innovative patch-loaded coupling cavity configurations [21,22] and multilayer transition architecture [23]. The second category is horizontally connected structures such as a fin-line structure [24] and a height or width stepped waveguide transformer [25,26].…”
Section: Introductionmentioning
confidence: 99%
“…In the past decades, various approaches have been presented to achieve the transition from a substrate-integrated waveguide to an air-filled RWG based on traditional printed circuit board (PCB) technology [ 5 , 6 , 7 , 8 , 9 ]. However, the permittivity of LTCC dielectric substrate is high.…”
Section: Introductionmentioning
confidence: 99%