Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology 2006
DOI: 10.1115/imece2006-13104
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A By-Pass Sensor Package Design Enabling the Use of Microfluidics in High Flow Rate Applications

Abstract: The package design for microfluidic sensors is discussed. The MicroElectroMechanical Systems (MEMS) device covered in this paper requires a fluidic and electrical interface as well as vacuum packaging of the sensing element. By using a by-pass package design the limitations of low flow rate and high pressure drop often encountered with microfluidic products can be avoided. The MEMS device utilizes a resonating silicon microtube that is electrostatically driven and capacitively sensed. A platinum RTD is also in… Show more

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Cited by 3 publications
(2 citation statements)
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“…These relatively high flow rates cannot be accommodated using a standalone microtube due to highpressure drop. To enable the use of higher flow rates a bypass package design is employed [14]. The system is designed to operate between 5 and 50 • C. The device shown in Fig.…”
Section: Methodsmentioning
confidence: 99%
“…These relatively high flow rates cannot be accommodated using a standalone microtube due to highpressure drop. To enable the use of higher flow rates a bypass package design is employed [14]. The system is designed to operate between 5 and 50 • C. The device shown in Fig.…”
Section: Methodsmentioning
confidence: 99%
“…To accommodate higher flow rates a compact, by-pass package design has been developed, with a transition to low-cost plastic electro-fluidic packages as the final goal. The novel by-pass package design opens this technology up to many high-flow rate applications [5].…”
Section: Transducers and Eurosensors '07mentioning
confidence: 99%