A Chip-First Microwave Package Using Multimaterial Aerosol Jet Printing

Craton, Michael Thomas; Konstantinou, Xenofon; Albrecht, John D.; Chahal, Premjeet; Papapolymerou, John

doi:10.1109/tmtt.2020.2992074

Cited by 38 publications

(16 citation statements)

References 23 publications

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“…Multi-material 3D printing enables ceramic capacitors to be fabricated directly from digital models, which provides an effective tool to enhance the flexibility of the substrate, material, and design, as well as reduce consumption and turnaround time [ 196 ]. Reviewing the recent research on multi-material 3D printing of ceramic capacitors, two major dielectric materials have been developed: pure ceramics [ 184 , 185 , 186 , 187 , 197 , 198 , 199 ] and ceramic/polymer composites [ 200 , 201 , 202 , 203 , 204 , 205 , 206 , 207 ]. For example, Rammal et al [ 197 ] presented a fully inkjet-printed metal-insulator-metal (MIM) capacitor formed by layer-on-layer deposition of silver nanoparticle and ceramic nanoparticle (a low-temperature cofired ceramic material from Heraeus) based inks.…”

Section: Applications Of Multi-materials 3d Printing In Functional Ce...mentioning

confidence: 99%

“…Ring resonator circuits and MIM capacitors were printed on a molybdenum copper alloy (85% Mo and 15% Cu) carrier to characterize the BaTiO 3 /polyimide composite films. The same authors also demonstrated two chip-first microwave packages with integrated bypass capacitors on the same molybdenum copper alloy carrier [ 207 ], characterized by a maximum packaged gain of 21.7 dB and saturated output power of 21.9 dBm.…”

Section: Applications Of Multi-materials 3d Printing In Functional Ce...mentioning

confidence: 99%

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Recent Advances in Multi-Material 3D Printing of Functional Ceramic Devices

et al. 2022

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In recent years, functional ceramic devices have become smaller, thinner, more refined, and highly integrated, which makes it difficult to realize their rapid prototyping and low-cost manufacturing using traditional processing. As an emerging technology, multi-material 3D printing offers increased complexity and greater freedom in the design of functional ceramic devices because of its unique ability to directly construct arbitrary 3D parts that incorporate multiple material constituents without an intricate process or expensive tools. Here, the latest advances in multi-material 3D printing methods are reviewed, providing a comprehensive study on 3D-printable functional ceramic materials and processes for various functional ceramic devices, including capacitors, multilayer substrates, and microstrip antennas. Furthermore, the key challenges and prospects of multi-material 3D-printed functional ceramic devices are identified, and future directions are discussed.

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Section: Applications Of Multi-materials 3d Printing In Functional Ce...mentioning

confidence: 99%

Section: Applications Of Multi-materials 3d Printing In Functional Ce...mentioning

confidence: 99%

Recent Advances in Multi-Material 3D Printing of Functional Ceramic Devices

et al. 2022

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“…From the above analysis of the fixed parameters of the double-bondwire and the position in the coordinate system, the linear function equations of BW1 and BW2 in the XOZ-dimensional coordinate system can be established, as shown in (17) and (18), respectively.…”

Section: Single-bondwirementioning

confidence: 99%

“…In other works, some researchers have applied the bondwire model to the design of RF devices, [9][10][11][12][13][14] taking the design of a PA as an example, the bondwire is used to participate in signal transmission and forming matching networks in the PA design of each band. [15][16][17][18][19][20] The integration of these PAs include internal matching mode and MMIC. Although some models are reported to be applicable to 100 GHz, their accuracy cannot satisfy the PA designer's needs.…”

Section: Introductionmentioning

confidence: 99%

“…In other works, some researchers have applied the bondwire model to the design of RF devices, 9–14 taking the design of a PA as an example, the bondwire is used to participate in signal transmission and forming matching networks in the PA design of each band 15–20 . The integration of these PAs include internal matching mode and MMIC.…”

Section: Introductionmentioning

confidence: 99%

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Study of harmonic control power amplifier technology based on improved modeling of bondwire

Zhong

Song

et al. 2022

Int J RF Mic Comp-Aid Eng

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Wire bonding is widely used in various radio frequency (RF) devices and is one of the common forms of signal interconnection. In this article, a new geometric model with related physical parameters is used to describe various actual types of the bondwire, and the corresponding calculation method for the total length of the bondwire is obtained. Consequently, a new equivalent circuit modeling method of the single‐bondwire can be developed and the accuracy of model has been improved. On this basis, using the concept of partial inductance, the modeling method of double‐bondwire is proposed, which can be applied to asymmetric double‐bondwire modeling. The model of bondwire obtained by this modeling method is applied to the design of PA, and the special electrical properties of the bondwire are used to verify a novel harmonic control method, which second and third harmonics could be controlled. The results show that in the Sub‐6G, the proposed bondwire model has good accuracy, and its performance is close to the measured results. The designed PA combined with harmonic control network has good performance, achieving drain efficiency of 62.6%–70% and output power of 40–41.5 dBm at 3.2–3.8 GHz. It is proved that the proposed bonding line modeling method can be applied to the design of high‐efficient PA.

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A Real‐Time Process Diagnostic to Support Reliability, Control, and Fundamental Understanding in Aerosol Jet Printing

Rurup,

Secor

2023

Adv Eng Mater

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Aerosol jet printing is a compelling technology for hybrid electronics, combining digital and noncontact patterning with broad materials compatibility, resolution as fine as ≈10 microns, and a high standoff distance of 1–5 mm. Despite its growing popularity in research environments, a robust process understanding and improved manufacturing control are essential for achieving the reliability and predictability required for broader adoption in advanced applications. Herein, recent developments in process monitoring using in‐line light scattering measurements are discussed, including their mechanistic foundations, experimental validation, relevance for process control and reliability, and value as a diagnostic tool for fundamental studies. Experimental measurements confirm the correlation between measured light scattering and deposition rate. Building on this platform, feedback from the real‐time measurement is coupled with printer software to support automated closed‐loop control via a simple proportional‐integral‐derivative software control loop. Combined with the utility of these measurements as a diagnostic to accelerate ink formulation and support fundamental process science experiments, this in‐line measurement provides a useful tool to improve print reliability with the potential to advance the adoption and capabilities of this method in conformal, flexible, and hybrid electronics applications.

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A Chip-First Microwave Package Using Multimaterial Aerosol Jet Printing

Cited by 38 publications

References 23 publications

Recent Advances in Multi-Material 3D Printing of Functional Ceramic Devices

Recent Advances in Multi-Material 3D Printing of Functional Ceramic Devices

Study of harmonic control power amplifier technology based on improved modeling of bondwire

A Real‐Time Process Diagnostic to Support Reliability, Control, and Fundamental Understanding in Aerosol Jet Printing

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