A circuit approach to model narrow slot structures in a power bus

Zhang, L.; Archambeault, Bruce; Conner, S.; Knighten, J.L.; Fan, Jun; Smith, N.W.; Alexander, R.; DuBroff, R.E.; Drewniak, James L.

doi:10.1109/isemc.2004.1349825

Cited by 10 publications

(6 citation statements)

References 7 publications

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“…For the slots or apertures in the exterior planes, they can be modelled as a coupled transmission line or a co-planar slot line, and then connected to the cavity model [48]- [50]. For the slots or apertures in the interior planes between two cavities, an extended cavity model method using the magnetic current and "magnetic voltage" definitions has been proposed in [20], which can be easily combined with the standard cavity model.…”

Section: Traces Components and Slotsmentioning

confidence: 99%

Mitigation of Noise Coupling in Multilayer High-Speed PCB: State of the Art Modeling Methodology and EBG Technology

Fan

Paulis

et al. 2010

IEICE Trans. Commun.

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SUMMARYNoise coupling on the power distribution networks (PDN) or between PDN and signal traces is becoming one of the main challenges in designing above GHz high-speed digital circuits. Developing an efficient and accurate modeling method is essential to understand the noise coupling mechanism and then solve the problem afterwards. In addition, development of new noise mitigation technology is also important for future high-speed circuit systems. In this invited paper, a novel modeling methodology that is based on the physics-based equivalent circuit model will be introduced, and an example of multiple layer PCB circuits will be modeled and validated with good accuracy. Based on the periodic structure concept, several new electromagnetic bandgap structures (EBG), such as coplanar EBG, photonic crystal power layer (PCPL), and ground surface perturbation lattice (GSPL), will be introduced for the mitigation of power/ground noise. The trade/offs of all these structures will be discussed.

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Section: Traces Components and Slotsmentioning

confidence: 99%

Mitigation of Noise Coupling in Multilayer High-Speed PCB: State of the Art Modeling Methodology and EBG Technology

Fan

Paulis

et al. 2010

IEICE Trans. Commun.

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“…It is worthy to note that this research work is motivated by the previous paper of one of the co-authors [16]. In that paper, the main concept of the transmission line model is proposed.…”

Section: Introductionmentioning

confidence: 98%

“…The regular portion of the power bus can be modelled as resonant cavities, and their impedance properties are easily calculated via summation of the corresponding cavity modes [10]. On the other hand, the slot is viewed as a coupled microstrip line [16]. Through the even and odd mode analysis, the distributed inductances and capacitances are extracted and expressed by analytical formulas related to the structure's geometry and dielectric properties.…”

Section: Introductionmentioning

confidence: 99%

SPICE-Compatible Cavity and Transmission Line Model for Power Bus with Narrow Slots

Feng

Zhang

Drewniak

et al. 2007

2007 IEEE International Symposium on Electromagnetic Compatibility

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Segmental lumped circuits are derived from coupled transmission line model for a narrow slot on the power bus. Both electric and magnetic coupling are taken into account by distributed inductances and capacitances. Then a SPICEcompatible circuit model for the power bus with the narrow slot is proposed. In this model, the segmental lumped circuits are connected to the equivalent circuit, which is derived by a hybrid cavity model and segmentation method for irregular power/ground planes. The model is validated by comparing with the calculations of finite element method (FEM) for the self or mutual impedances of the two port networks located in the power bus.

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“…Although hybrid modeling methods based on a resonant cavity model and a segmentation method for isolation structures of a power bus in a two-layered PCB were successfully demonstrated in [21], [22], in this paper, the isolation structures of a power bus consisting of multilayered power and ground planes are analyzed using the hybrid modeling method for the first time. For the analysis of a multilayered structure, a port assignment technique and an analytical equation to model the split gap in multilayered package are proposed.…”

Section: Introductionmentioning

confidence: 99%

Hybrid analytical modeling method for split power bus in multilayered package

Jeong

Wai

et al. 2006

IEEE Trans. Electromagn. Compat.

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Abstract-As multiple chips are being integrated into a single package with increased operating frequency, switching noise coupling on power buses has become an important design issue. To reduce the noise coupling, a split power bus structure has been generally used in package substrates having multilayered power and ground planes. Consequently, there is an increasing need for an efficient method to analyze a split power bus in a multilayered package. This paper introduces a hybrid analytical modeling method for characterizing a split power bus in a multilayered package. The proposed method uses a resonant cavity model combined with a segmentation method. Furthermore, a port assignment technique and an associated calculation method for the equivalent circuit model parameter of the split gap are proposed. The proposed port assignment technique and the analytical equation make it possible to analyze a split power bus, especially in a multilayered package. To verify the proposed method, multilayered test packages are fabricated and tested by means of frequency-domain measurements. In addition, an optimal power bus design method was successfully demonstrated for suppressing noise coupling between chips on a single package. Finally, the proposed method and optimal power bus design method was verified using a series of frequency-domain and time-domain measurements.Index Terms-Multilayered package substrate, resonant cavity model, segmentation method, simultaneous switching noise (SSN), split power bus.

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A circuit approach to model narrow slot structures in a power bus

Cited by 10 publications

References 7 publications

Mitigation of Noise Coupling in Multilayer High-Speed PCB: State of the Art Modeling Methodology and EBG Technology

Mitigation of Noise Coupling in Multilayer High-Speed PCB: State of the Art Modeling Methodology and EBG Technology

SPICE-Compatible Cavity and Transmission Line Model for Power Bus with Narrow Slots

Hybrid analytical modeling method for split power bus in multilayered package

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