A CMOS-compatible large-scale monolithic integration of heterogeneous multi-sensors on flexible silicon for IoT applications

Abstract

CitationNassar JM, Sevilla GAT, Velling SJ, Cordero MD, Hussain MM (2016)

Review and Perspectives of Micro/Nano Technologies as Key-Enablers of 6G

“…Within the same frame of reference, a recent research trend is that pursuing integration of multitudes of diverse sensors on flexible and possibly low-cost substrates. The resulting complex devices, depending on their final use, are often indicated as smart skin, and they are of great interest within the contexts of robotics and wearables [131]- [133].…”

Personalized Healthcare: CMOS Enabled Microfluidic Systems for Healthcare Based Applications (Adv. Mater. 16/2018)

“…As sensors are an integral part of any LOC system, Nassar et al successfully showed the integration of multifunctional CMOS sensors on a large-scale flexible silicon platform. [153] Their heterogeneous and monolithic integration approach uses only CMOScompatible fabrication processes on bulk monocrystalline silicon (100). [153] The sensors include temperature RTDs, pressure, strain, and humidity, which are all vital sensing elements needed for the characterization and understanding of fluid behavior inside microfluidic channels.…”

“…[153] Their heterogeneous and monolithic integration approach uses only CMOScompatible fabrication processes on bulk monocrystalline silicon (100). [153] The sensors include temperature RTDs, pressure, strain, and humidity, which are all vital sensing elements needed for the characterization and understanding of fluid behavior inside microfluidic channels. This flexible silicon platform is compatible with the one-chip integration of silicon-based data processing units and interface circuitry required for a complete LOC system.…”

Practical aspects of thermomechanical modeling in electronics packaging: A case study with a SiC power package

“…Consequently, advanced packaging has emerged, such as 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, using through-silicon via (TSV) interposer, or TSV-less, fan-out, and other interconnect technology. Numerous integration methods and fabrication techniques have been developed [1][2][3]. Furthermore, heterogeneous integration (HI) brings a new revolution for microelectronics packaging in the post-Moore era.…”