A combined simulation and experimental study on cracking and delamination behavior at the Cu/Polyimide interface of RDLs in chiplet package subjected to thermo-mechanical loads

Chen, Bin; Lyu, Guang-Chao; Wang, Hongguang; Zheng, Long; Deng, Yun-Kai

doi:10.1109/ectc51909.2023.00351

Cited by 3 publications

(1 citation statement)

References 14 publications

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“…The RDL is generally composed of polyimide PI, a diffusion-resistant Ti layer, and Cu wiring. Due to the CTE mismatch between PI/Cu and the non-gas-tightness of PI, which can allow H 2 O and O 2 to pass through, the final delamination of the RDL is caused under dynamic service environments [79,80].…”

Section: Addition Of Barrier Layer On Top Of Rdl Stacksmentioning

confidence: 99%

Delamination of Plasticized Devices in Dynamic Service Environments

Tian,

Chen,

Zhang

et al. 2024

Micromachines

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With the continuous development of advanced packaging technology in heterogeneous semiconductor integration, the delamination failure problem in a dynamic service environment has gradually become a key factor limiting the reliability of packaging devices. In this paper, the delamination failure mechanism of polymer-based packaging devices is clarified by summarizing the relevant literature and the latest research solutions are proposed. The results show that, at the microscopic scale, thermal stress and moisture damage are still the two main mechanisms of two-phase interface failure of encapsulation devices. Additionally, the application of emerging technologies such as RDL structure modification and self-healing polymers can significantly improve the thermal stress state of encapsulation devices and enhance their moisture resistance, which can improve the anti-delamination reliability of polymer-based encapsulation devices. In addition, this paper provides theoretical support for subsequent research and optimization of polymer-based packages by summarizing the microscopic failure mechanism of delamination at the two-phase interface and introducing the latest solutions.

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Section: Addition Of Barrier Layer On Top Of Rdl Stacksmentioning

confidence: 99%