A combined solution of thermoelectric coolers and microchannels for multi-chip heat dissipation with precise temperature uniformity control

Cong, Bo; Kong, Yanmei; Ye, Yuxin; Liu, Ruiwen; Du, Xiangbin; Yu, Lihang; Jia, Shiqi; Jiao, Binbin; Qu, Zhiguo

doi:10.1016/j.applthermaleng.2022.119370

Cited by 21 publications

(2 citation statements)

References 34 publications

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“…With the advantaged stacking package technology development, the power device microsystem package becomes further compact to endorse the miniaturization of high computing performance, communication technology, and other emerging electronic information systems 22,23 . The active cooling packages make it difficult to guarantee the junction temperature uniformity for the device array 24 . In contrast, the coolants inside the passive cooling packages are solitarily driven by the temperature gradient and the capillary force.…”

Section: Introductionmentioning

confidence: 99%

Co-designing chip package structure on the ceramic vapor chamber for the high-conducting heat packaging

Bai,

Wang,

Zhang

et al. 2024

Preprint

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Conventional chip packaging generates a huge thermal resistance due to the low thermal conductivity of the packaging materials that separate chip dies and coolant. Some chip package structures with liquid cooling are developed, but at the same time, these will bring additional risks to running safety. Here we propose and fabricate a completely closed high-conducting heat chip package based on the passive phase change and the compatible material with the chip dies: chip on vapor chamber (CoVC), to realize the rapid diffusion of the heat of hot spots, so as to completely eliminate the energy consumption of the refrigeration which usually takes up the largest share in the power of the heat management. Multi-scale wicks and bionic vein structures are applied to CoVC. The multi-scale wick could increase the turning heat load of the CoVC from 20 W to 140 W, which was a 600% increase. The combination of bionic vein structure and CoVC has an increase of 164% in the heat transfer performance. The thermal resistance of the package was only a third of that traditional package. This means that the structure of CoVC has a good ability in thermal conducting and can reduce energy consumption for heat dissipation.

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Section: Introductionmentioning

confidence: 99%

Co-designing chip package structure on the ceramic vapor chamber for the high-conducting heat packaging

Bai,

Wang,

Zhang

et al. 2024

Preprint

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“…However, despite the clear need and potential impact, a discerning look at prevalent methodologies reveals palpable gaps. Current strategies in investigating the heat dissipation conundrum in vehicle-mounted phased array radars are often deemed too risk-averse, with a tendency to default to traditional paradigms [18,19]. This has invariably led to a lack of comprehensive insight into intricate heat transfer dynamics.…”

Section: Introductionmentioning

confidence: 99%

Structural Enhancement and Thermal Deformation Analysis of Antenna Arrays in Vehicle-Mounted Phased Array Radar: A Heat Dissipation Perspective

Meng,

Yang,

Zhou

et al. 2023

IJHT

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In the evolving landscape of modern warfare, an escalating importance is being attributed to vehicle-mounted phased array radars due to their imperative role in information acquisition and mastery. A significant limitation to their performance lies in the challenges of heat dissipation and resultant thermal deformation of the antenna array surface. Current methodologies for predicting thermal deformation and techniques for heat dissipation exhibit inherent shortcomings, rendering them inadequate for varying radar systems and diverse operational environments. To address this, heat transfer characteristics of microchannels on the antenna array surface of vehicle-mounted phased array radar were investigated. A novel design paradigm for the structural optimisation of the antenna array surface was subsequently proposed. In addition, a cutting-edge thermal deformation prediction method utilising a Particle Swarm Optimization (PSO)-Genetic Algorithm (GA)-Back Propagation Neural Network (BPNN) synergy was presented, aiming to overcome the deficiencies observed in existing prediction models. The insights garnered from this research offer potential pathways for the refinement of radar antenna array structures and are poised to pave the way for future advancements in this domain.

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Modelling transient states of thermoelectric systems

Buchalik

Nowak

2023

Applied Thermal Engineering

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A combined solution of thermoelectric coolers and microchannels for multi-chip heat dissipation with precise temperature uniformity control

Cited by 21 publications

References 34 publications

Co-designing chip package structure on the ceramic vapor chamber for the high-conducting heat packaging

Co-designing chip package structure on the ceramic vapor chamber for the high-conducting heat packaging

Structural Enhancement and Thermal Deformation Analysis of Antenna Arrays in Vehicle-Mounted Phased Array Radar: A Heat Dissipation Perspective

Modelling transient states of thermoelectric systems

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