A Compact Broadband Folded Dipole Antenna Element With Ball Grid Array Packaging for New 5g Application

Abstract

A compact broadband folded dipole antenna element with a ball grid array packaging is proposed in this letter. The compact antenna element is fabricated on a low-cost FR4 substrate consisting of only one dielectric layer. The solder balls are mounted on the square ground metal plane of the antenna element to form the ball grid array (BGA) packaging, which allows the antenna element to be surface mounted with other surface-mount devices (SMDs). Furthermore, ball grid array packaging has great potential for minimizing the size of antenna elements. The dimension of the proposed antenna element is only 6 mm × 6 mm × 1.6 mm. Parameter analysis shows that the solder balls have little effect on antenna performance. The proposed folded dipole antenna element is fed by a 50 Ω grounded coplanar waveguide (GCPW) transmission line on the evaluation board. The antenna prototype has been designed, analyzed, and manufactured. Measured results of the prototype show that the −10 dB impedance bandwidth is 45.4% , and the peak gain achieves 6.62 dBi at 35 GHz. The measurement results show that the proposed antenna element has great potential for the 5G millimeter wave application.

Miniaturized metallic symmetrical resonator backed CPW inspired dual band filter using Meander line for 5G mm‐wave applications

“…Hence, 5G mm-wave filters are highly complicated to realize due to variations in component specification which results to high circuit complexity and high manufacturing cost. [4][5][6][7][8][9] Few other microwave circuits that have been designed are mm-wave 5G dual band diplexer using ring resonators are presented in Shaman et al, 10 a 5G dual band filter with resonator are analyzed in Nouri et al, 11 a novel higher order BPF for mm-waves has been developed and investigated for SIW cavities, 12 a antenna with grid array packaging for 5G applications are analyzed in 13 and wide band F shaped antenna for 5G Vehicle-to-Everything communications was introduced in Yacoub et al 14 In next generation wireless communication system, miniaturization of RF components has been required constantly for the development of low cost wireless communication system. Moreover, transmission lines also need to be miniaturized to reduce the size of RF components, because all distributed RF components are basically modeled as transmission line.…”

Cost-Effective Compact Dual-Band Patch Antenna Based on Ball Grid Array Packaging for 5g Mmwave

“…Inspired by the above results, this letter proposes a dual-band patch antenna based on BGA packaging for the 5G mmWave applications. Based on our previous research [16], the proposed antenna achieves compact size by using BGA packaging. The antenna uses a single FR4 substrate, which reduces the cost.…”