A compact parallel dispensing machine of high-viscous adhesive based on electrostatic-induced mechanism

Abstract

Adhesive bonding process has been widely applied in the assembly of micro-electro-mechanical system products, in which the e cient micro-dispensing technique of high-viscous liquid is important for the bonding performance. In this paper, we propose a compact and portable machine for the parallel dispensing task of high-viscous adhesive based on electrostatic-induced mechanism. The designed exible probe array can reduce the impact of height difference Δh on transferring stage to thereby improve the dispensing consistency. With the developed machine, both parallel and serial dispensing modes are built up with replaceable dispensing head to satisfy various requirements. The dispensing e ciency is increased by 91.44% via parallel dispensing mode, comparing with previous single-probe mode. In addition, smart patterning with Mean square deviation σ d less than 0.026 mm is achieved with both the con gurable probe-status and the replaceable dispensing head. We believe this machine can be used e ciently and smartly in the adhesive bonding process.