2022 International Conference on Applied Physics and Computing (ICAPC) 2022
DOI: 10.1109/icapc57304.2022.00046
|View full text |Cite
|
Sign up to set email alerts
|

A Comparative Analyze of FinFET and Bulk MOSFET SRAM Design

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1

Citation Types

0
1
0

Year Published

2023
2023
2023
2023

Publication Types

Select...
1
1

Relationship

0
2

Authors

Journals

citations
Cited by 2 publications
(1 citation statement)
references
References 30 publications
0
1
0
Order By: Relevance
“…FinFET technology, despite its advancements, has drawbacks including complex and costly manufacturing, higher leakage currents, increased power consumption, performance variations due to fin width variability, and reliability issues. These limitations emphasize the importance of ongoing research to overcome FinFET challenges 3–5 . The Gate‐all‐around nanosheet field‐effect transistor (FET) is an innovative electronic device that has recently gained significant attention.…”
Section: Introductionmentioning
confidence: 99%
“…FinFET technology, despite its advancements, has drawbacks including complex and costly manufacturing, higher leakage currents, increased power consumption, performance variations due to fin width variability, and reliability issues. These limitations emphasize the importance of ongoing research to overcome FinFET challenges 3–5 . The Gate‐all‐around nanosheet field‐effect transistor (FET) is an innovative electronic device that has recently gained significant attention.…”
Section: Introductionmentioning
confidence: 99%