2019 IEEE Applied Power Electronics Conference and Exposition (APEC) 2019
DOI: 10.1109/apec.2019.8722048
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A Comparative Study of Failure-Tolerant Three-phase RTRUs for More Electric Aircrafts

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Cited by 6 publications
(4 citation statements)
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“…Here, the analytic expression for the energy buffering requirement ∆E dc,a is rather involved and therefore omitted. However, ∆E dc,a can be easily calculated numerically from (13) and is provided in Tab. 3.…”
Section: ) Conventional Modulationmentioning
confidence: 99%
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“…Here, the analytic expression for the energy buffering requirement ∆E dc,a is rather involved and therefore omitted. However, ∆E dc,a can be easily calculated numerically from (13) and is provided in Tab. 3.…”
Section: ) Conventional Modulationmentioning
confidence: 99%
“…1). Further, such a phase-modular realization features a high failure tolerance [13] and the system can continue operation with reduced output power in case one or even two converter modules fail. The main weakness of a phase-modular converter realization is, however, the fact that the input power of each PFC rectifier module pulsates at twice the mains frequency (which is inherent to single-phase power conversion) such that large dc-link capacitors C dc are required, which may cover a large fraction of the overall converter volume and/or limit the system lifetime [18], [19].…”
Section: Introductionmentioning
confidence: 99%
“…From the above two equations involving T HS , the upper bound of heatsink thermal resistance can be found out, as shown below [35]:…”
Section: Thermal Management Systemmentioning
confidence: 99%
“…6), while not exceeding the maximum junction temperature. Hence, the limit on heatsink thermal resistance ( R th ) is given by the following relationships THS=Tambience+normalΔTmaxPdevice)(Rjc+Rcs Since the sum of all device power losses is dissipated on the heatsink, its temperature can be written as follows: THS=Tambience+Rsai=1nPdevice,thinmathspacei From the above two equations involving THS, the upper bound of heatsink thermal resistance can be found out, as shown below [35]: Rth<min)(normalΔTmaxPdevice,thinmathspacei)(Rjc+Rcsthickmathspaceforthinmathspaceiϵthickmathspace][1,thinmathspacenPheatsink The thermal resistance of the heatsink is a function of net volume, fin count, surface area, baseplate thickness, and fan speed under a force‐air‐cooled system. The thermal resistance of the heatsink is given by RHS=1h)(Abase+NfinAfinηfin where h is the convective heat transfer coefficient, A base is the exposed base surface area between fins, N fin is the number of fins, ηfin is the fin efficiency, and A fin is the surface area per fin taking into account both sides of the fin.…”
Section: Optimised Design Of the Rtru Systemmentioning
confidence: 99%