A Comparative Study on the Influence of SAC305 Lead‐Free Solder Sandwiched by Sn on the Micromechanical and Electrical Properties of the Joints

Char, Monalisa; Chakraborty, Amit; Bhattacharyya, A. S.; Kar, Abhijit

doi:10.1002/adem.202100679

Cited by 4 publications

(1 citation statement)

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“…Nanoindention is especially used for the determination of mechanical properties on a very small scale applicable to thin films and nanostructures and has been used by us over the last few years [1][2][3][4][5][6][7][8][9][10][11].. It is based upon load-depth (P-h) plots, which many researchers tried to generalize.…”

Section: Introductionmentioning

confidence: 99%

Unleashing Elastic-Plastic Response by Study of Simulated Nanoindentation <em>P-h</em> Plots

Praveen Kumar,

BHATTACHARYYA

2024

Preprint

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Nanoindentation load-depth (P-h) plots is the basis for determination of mechanical properties of the samples and is especially vital for thin coatings deposited on substrates of various mechanical makeup from amorphous-brittle (borosilicate glass) to Silicon (having different crystallographic texture) to ductile substrates like stainless steel as well other aspects like indenter tip shape. The elastic-plastic response by simulated P-h plots as per modified empirical relations have been presented. The outcomes of this computational studies enlighten the database on the P-h plots for various coating/substrate systems and shall aid in the analysis of experimental P-h plots obtained,

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Section: Introductionmentioning

confidence: 99%

Unleashing Elastic-Plastic Response by Study of Simulated Nanoindentation <em>P-h</em> Plots

Praveen Kumar,

BHATTACHARYYA

2024

Preprint

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Unexpected dual cracks in chip-ceramic substrate interconnect: Unveiling the mechanism behind simultaneous cracking at both the top and bottom of a solder joint

Liu,

Chen,

Nie

et al. 2025

Engineering Failure Analysis

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Stress distribution variations during nanoindentation failure of hard coatings on silicon substrates

Dash,

Bhattacharyya,

Bhattacharyya

2023

Nanotechnology and Precision Engineering

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Regarding quality inspection of technologically important nanocomposite hard coatings based on Ti, B, Si, C, and N and bioceramics such as hydroxyapatite that are used in small-scale high-precision devices and bio-implants, it is essential to study the failure mechanisms associated with nanoindentation, such as fracture, delamination, and chipping. The stress imposed by the indenter can affect the fracture morphology and the interfacial fracture energy, depending on indenter shape, substrate type, crystallographic properties, pre-existing flaws, internal micro-cracks, and pre-strain. Reported here are finite-element-based fracture studies that provide insights into the different cracking mechanisms related to the aforementioned failure process, showing that the fracture morphology is affected by the interaction of different cracking events. The interfacial fracture energy, toughness, and residual stress are calculated using existing models with minor adjustments, and it is found that increasing the indenter sharpness improves the shear stress distribution, making the coating more prone to separation. Depending on the prevailing type of stress, the stress distribution beneath the depression results in either crack formation or a dislocation pile-up leading to strain hardening. Different forms of resistances resulting from the indentation process are found to affect the tip–sample conduction, and because of its stronger induced plasticity than that of a Berkovich indenter tip, a sharper cube-corner tip produces more resistance.

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A Comparative Study on the Influence of SAC305 Lead‐Free Solder Sandwiched by Sn on the Micromechanical and Electrical Properties of the Joints

Abstract: The ORCID identification number(s) for the author(s) of this article can be found under https://doi.org/10.1002/adem.202100679.

Cited by 4 publications

References 64 publications

Unleashing Elastic-Plastic Response by Study of Simulated Nanoindentation <em>P-h</em> Plots

Unleashing Elastic-Plastic Response by Study of Simulated Nanoindentation <em>P-h</em> Plots

Unexpected dual cracks in chip-ceramic substrate interconnect: Unveiling the mechanism behind simultaneous cracking at both the top and bottom of a solder joint

Stress distribution variations during nanoindentation failure of hard coatings on silicon substrates

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